|
|
|
| United States Patent | 6026038 |
| Link to this page | http://www.wikipatents.com/6026038.html |
| Inventor(s) | Cho; Soo-In (Seoul, KR); Choi; Jong-Hyun (Suwon, KR) |
| Abstract | A wafer burn-in test circuit of a semiconductor memory device having a
plurality of memory cells arranged in a row/column matrix, is provided,
including: a sub word line driver connected to first and second word line
groups each connected to true cells and complement cells forming the
memory cells, and responding to a predecoded low address; and first and
second power lines respectively supplying power to the corresponding first
and second power line groups by a switching operation of the sub word line
driver, wherein a ground power source is applied to the first and second
power lines during a normal operation, and the ground power source and a
step-up power source are alternately applied to the first and second power
lines during a wafer burn-in test operation. |
|
|
 |
Title Information  |
|
|
|
|
|
Drawing from US Patent 6026038 |
|
|
Wafer burn-in test circuit and method for testing a semiconductor memory |
|
|
|
|
|
| Publication Date |
February 15, 2000 |
|
|
|
|
|
| Filing Date |
September 23, 1997 |
|
|
|
|
|
|
|
|
|
|
|
|
|
| Priority Data |
Sep 23, 1996
[KR]
96/41714
|
|
|
|
|
|
|
|
|
 |
|
 |
Title Information |
|
|
|
Claims |
|
|
What is claimed is:
1. A semiconductor memory device comprising:
a memory cell array having a plurality of memory cells and a plurality of corresponding reference cells;
a plurality of memory cell word lines each associated with one of said memory cells;
a plurality of reference cell word lines each associated with one of said reference cells;
a plurality of first subword line drivers each driving one of said memory cell word lines;
a plurality of second subword-line drivers each driving one of said reference cell word lines;
a first power line connected to said first subword line drivers;
a second line connected to said second subword line drivers;
wherein during an operation mode a ground potential is applied to said first and second power lines, and
wherein during a test mode there is supplied to either group of said memory cell word lines and reference cell word lines a ground potential through one of the first and second power lines, and there is supplied to the other group of said memory
cell word lines and reference cell word lines a stress potential different from the ground potential through the other one of first and second power lines.
2. The semiconductor memory device of claim 1 further comprising a switching circuit, said switching circuit applying the stress potential to either group of said memory cell word lines and reference cell word lines and the ground potential to
the other group of said memory cell words lines and reference cell word lines during the test mode.
3. The semiconductor memory device of claim 2, wherein said switching circuit is operable to alternate said stress potential between said memory cell word lines and reference cell word lines.
4. The semiconductor memory device of claim 3, wherein said switching circuit is further operable to alternate the ground potential between said memory cell word lines and reference cell word lines complementary to said stress potential.
5. The semiconductor memory device of claim 1, further comprising an address decoder operatively connected to said first and second subword-line drivers, said fast and second subword line drivers being operable to switch said memory cell word
lines and reference cell word lines to the ground potential for discharging responsive to signals from said address decoder when said memory device is in the operating mode.
6. The semiconductor memory device of claim 5, wherein said first and second subword line drivers are further operable to switch said memory cell word lines and reference cell word lines to the stress and ground potential responsive to signals
from said address decoder when said memory device is in the test mode.
7. A method for testing a semiconductor memory device of the type having a plurality of memory cells and a plurality of corresponding reference cells, and wherein said memory cells and reference cells are addressed responsive to a signal applied
to associated memory cell word lines and reference cell word lines respectively, said method comprising the steps of:
connecting either group of said memory cell word lines and reference cell word lines to a ground potential; and
connecting the other group of said memory cell word lines and reference cell word lines to a stress potential different than the ground potential.
8. The method of claim 7, wherein said semiconductor memory device further includes first subword line drivers for driving memory cell word lines associated with memory cells, and second subword line drivers for driving word lines associated
with reference cells, and wherein said method further comprises placing said memory device in a test mode responsive to application of signals to said subword line drivers.
9. The method of claim 8, wherein said method comprises the steps of:
connecting either group of said memory cell word lines and reference cell word lines to the stress potential; and
connecting the other group of said memory cell word lines and reference cell word lines to the ground potential.
10. The method of claim 8 further comprising the step of connecting said memory cell word lines and reference cell word lines to the ground potential upon completion of testing.
11. A wafer burn-in test circuit for a semiconductor memory device having a plurality of storage cells arranged in a matrix of rows and columns, said circuit comprising:
first word lines connected to a plurality of said storage cells;
second word lines connected to a plurality of said storage cells different from those connected to said first word lines; and
first and second power lines respectively supplying power to the corresponding first and second word lines responsive to signals generated by an address decoder in said memory device, a ground potential being applied to said first and second
power lines during an operation mode, and a stress potential and a ground potential being alternately supplied to said first and second power lines during a test mode.
12. The circuit of claim 11, wherein said circuit further comprises a switching circuit connected between said first and second power lines and a pair of terminals, said switching circuit being operable to alternately connect said terminals with
said first and second power lines.
13. The semiconductor memory device of claim 6, wherein each of said memory cells is associated with one of said corresponding reference cells and wherein each memory cell and its associated reference cell are operable to maintain the data in
the associated reference cell complementary to the data in the memory cell. |
|
|
|
|
|
|
Claims |
|
|
|
Description |
|
|
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a wafer test circuit for a semiconductor memory device and, more particularly, to a wafer burn-in test circuit and a method of testing a semiconductor memory device which tests for defects in the semiconductor
device by applying a stress voltage Which exceeds the-normal operating voltage of the device.
2. Description of the Related Art
Manufacturers of semiconductor memory devices usually perform a burn-in test to test for memory cell defects after manufacturing is substantially complete. The burn-in test is typically performed after the chip is packaged. Therefore, if it is
determined in the final burn-in test step that there is a defect in the wafer, the failed portion of the wafer is discarded, even though the manufacture of the product is substantially complete. The test method is therefore inefficient.
It would be desirable to perform the wafer burn-in test earlier in the manufacturing process. A scheme is exemplified to perform the burn-in test in the wafer fabrication step. Specifically, in case of a dynamic random access memory (DRAM),
most of burn-in failures are the single bit failure, the testing for which requires much time. A single bit failure is directly related to a leakage of an incomplete memory cell. The current leakage results from defects in the transmission gate oxide,
capacitor dielectric and memory node junction. A conventional wafer burn-in (WBI) testing circuit is realized differently depending upon the word line structure of the memory device. In addition, each node stress is also variable according to the WBI
operation. Exact screening is therefore not possible.
FIG. 1 illustrates a WBI structure applicable to a memory cell array structure of a subword-line driver.
A row decoder (not shown) provides decoded addresses .phi.PRE1 and .phi.PRE2 to the subword-line driver of FIG. 1 in a normal operating mode to thereby drive a word line WL and thus select an intended cell. The word line driver is made up of
transistors 101 through 103, inverter 104 and transistors 105, 106. The operation of the subword-line driver of FIG. 1 is described first during normal operation and then during a wafer burn-in test performed by the manufacturer.
A wafer burn-in enable signal WBI is a low level signal during normal operation. A row predecoding signal .phi.PRE1 is also low. A low predecoding signal /.phi.PRE2 is an inverted signal of the predecoding signal .phi.PRE2. To place the
circuit in the wafer burn-in test mode, the wafer burn-in enable signal WBI is set to a high level thereby turning on the transistor 105. A word line stress voltage Vstress is applied through the path for discharging the word line WL, so that the stress
affects the memory cell. This kind of circuit operation screens for oxidation defects of the transmission transistor due to the word line stress, but cannot apply a bit line stress because all of the word lines are enabled and the same data is therefore
written into the cell connected to the corresponding word line. The same voltage is therefore applied between the bit lines and defective cells, which might be affected by a large stress potential, are not destroyed and thus not detected during testing.
SUMMARY OF THE INVENTION
The present invention comprises a wafer burn-in test circuit and testing method for a semiconductor memory device having a plurality of storage cells arranged in a matrix of rows and columns. A first word line is connected to a plurality of
storage cells and a second word line is connected to a plurality of storage cells different from those connected to the first word line. First and second power lines respectively supply power to the corresponding first and second word lines responsive
to signals generated by an address decoder in the memory device. A ground potential is applied to the power lines during an operation mode and a stress voltage and a ground potential are alternately supplied to the first and second power lines during a
test mode.
An object of the invention is to provide a wafer burn-in test circuit and method in which defects are discovered early in the manufacturing process.
Another object of the invention is to provide a wafer burn-in test circuit and method capable of stressing a bit line as well as a word line.
Yet another object of the invention is to provide a wafer burn-in test circuit which reduces the production expense of a memory chip.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 illustrates the structure of a conventional wafer bum-in test circuit;
FIG. 2 illustrates the structure of a wafer bum-in test circuit constructed in accordance with the invention;
FIG. 3 illustrates a wafer bum-in test circuit and a memory cell array of the invention; and
FIG. 4 schematically illustrates pads for supplying a stress voltage and a ground potential and a memory cell array according to the invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT
With reference to the attached drawings, preferred embodiments of the invention will be described below. Similar reference numerals denote similar structure throughout the specification and drawings.
FIGS. 2-4 illustrate a circuit for performing a burn-in test while the memory device is still on the wafer.
As illustrated in FIG. 4, the entire chip is structured into a lead on chip (LOC). Four banks B1 to B4 having a plurality of sub memory cell arrays (MCA), which are made up of memory cells arranged in a row and column matrixes, are placed at
four corners of the chip. The pads are arranged at the center of the chip. The peripheral circuits of each position are not described here, but only the parts related to the wafer burn-in (WBI) test will be described below.
It is hard to realize highly integrated chips employing a strapping structure using metals and polysilicon gates. As the density gets higher, the cell gets smaller thereby reducing the metal pitch so that the polysilicon and metal cannot be
connected in the strap region. Therefore, to solve the problem, there is introduced a subword-line drive (SWD) structure. The structure needs a metal line only for each 4 word lines or 8 word lines thereby extending the intervals of metal. The
invention therefore is applicable for a memory device having SWD structure rather than the conventional WBI structure.
VSS-C and VSS-T in FIG. 2 are used for the ground power source VSS of the SWVD, during a normal operating mode, and discharge the word lines when they are disabled. The VSS-C and VSS-T respectively control each halved SWD. During normal
operation, the same voltage VSS is applied to the word lines WL-C and WL-T from each outer power source pad VSS and STRESS via a switching part SW. When the circuit is in the wafer burn-in test mode, switch SW alternately applies a ground power source
VSS(0V) and the stress voltage on the pads to word lines VSS.sub.-- C and VSS.sub.-- T, thereby testing the memory cells. The ground and stress potentials are applied externally of the circuit using the two pads VSS and STRESS.
The sub memory cell array MCA of FIG. 4 is illustrated in FIG. 3 in detail. FIG. 3 illustrates the sub memory cell array MCA and the sub word line driver SWD for driving the word lines. The MCA includes a plurality of storage node pairs for
storing a bit and the complement thereof; a pair of bit lines BL and /BL for storing or accessing the bit and the complement thereof, respectively; and a pair of MOS transistors (not shown) controlled by the voltage applied to the WL. The
thus-structured memory cell is the known one transistor-one capacitor type. A sense amplifier SA connected to the pair of bit lines BL, /BL amplifies the voltages for storing data into or reading data out of the storage nodes.
SWD is controlled by a signal MWEi driven according to the predecoding operation of the low address predecoding signal, and by signals PXO(/PXO), PX1(/PX1), PX2(/PX2), PX3(/PX3) which are driven by subrow decoders. SWD is the VSS power line used
in disabling the selected word line and non-selected word line during the normal operation. The VSS power line is made up with the VSS-C and VSS-T by each SWD area. Here, in case of the normal operation, the row address predecoding signal MWEi, which
is from the main row decoder, is selected when VSS-C and VSS-T are 0V, and precharged to each node S0, S1, S2 and S3 of the SWD region (VCC-Vtn). One of the signals PX0, PX1, PX2 and PX3 is selected by the row address signal which is not related to the
signal MWEi, to thereby activate the word line.
When entering the WBI test mode as illustrated in FIGS. 2 and 3, the row address signal is disabled. Therefore, at the state that MWEi through MWEi and PX0 through PX3 become low level, and /PXO through /PX3, the inverted signals of PX0 through
PX3, are at a high level, VSS-T and VSS-C power lines are alternately applied as the VSS or the stress voltage. When the VSS-C is the VSS and the VSS-T is the stress voltage, only the word line WL-T, which is connected to the true cell (being connected
to BL) among the memory arrays, is enabled. On the other hand, when VSS-C is at the stress voltage and the VSS-T is the ground potential VSS, only a word line WL-C connected to the complement cell (associated with /BL) among the memory cell arrays, is
enabled. The VSS power line of the subword-line driver SWD area maintains the word line for driving the transmission transistor of the cell connected to the same bit lines BL and /BL into the VSS.
The VSS relation between the memory cell and the subword-line driver SWD area is such that in case of the previously-described WBI test, either a word line connected to the true cell or a word line connected to the complement cell is driven, so
that the storage node data connected to BL are always the same data, and the data of the storage connected to /BL are also the same data. Therefore, when the word line of the true cell and the word line of the complement cell are simultaneously
activated, the data applied to the pair of bit lines BL /BL are indistinct. Therefore, the stress is not applied to the process defect between the bit line BL and the complement bit line /BL in case of WBI. Therefore, the screening job is not available
during WBI test. In addition, various process defects such as the pair of bit lines BL, /BL and storage node or the pair of bit lines BL, /BL and word line WL, are not screened.
Therefore, the characteristic of the invention is that there is provided the memory device having SWD structure, which connects one VSS power line connected to the SWD area to the word line of the cell connected to the same bit line BL, and also
connects the other VSS power line to the word line of the cell connected to the other bit line /BL.
As described above, the wafer burn-in circuit according to the preferred embodiment of the invention can initially screen a minute defect of the semiconductor device, thereby guaranteeing long-term reliability. The invention is advantageous in
that the stress is applied through the bit line as well as the word line. Additionally, the invention can reduce the production expenses of the memory chip.
Therefore, it should be understood that the present invention is not limited to the particular embodiment disclosed herein as the best mode contemplated for carrying out the present invention, but rather that the present invention is not limited
to the specific embodiments described in this specification except as defined in the appended claims.
* * * * *
|
|
|
|
|
|
|
Description |
|
