A new amplifier module construction enhances the manufacturer's ability to repetitively construct multiple copies of millimeter microwave amplifiers having performance characteristics that are consistent with one another, particularly in input VSWR ratio characteristic, and which performance characteristic do not significantly change following any necessary rework of the amplifier module, including any MMIC chip replacement. In this module, a waveguide to microstrip transition is formed of a backshort member that is separate from the metal base or cover and that backshort member is held pressed in place against the substrate by force exerted by the module's cover plate through a spring member against the exterior of the backshort member. The spring member is formed by a resilient compressible gasket.
Development of Millimeter Wave Devices containing MMIC's is expedited by use of a new package for the MMIC's and associated electrical components that define the functional circuit. The package includes a base plate and a plurality of metal inserts removeably fastened to the base plate. The inserts are spaced apart and contain a profiled edge with the profiled edge in one in confronting spaced relationship with that of another of the inserts. Together with the backplate, the profiled edges define elongated cavities, serving as two of the cavities side walls. The cavities serve as a repository for the MMIC devices and some of the additional components and stripline. Should extraneous resonances be discovered, the insert can be removed and adjusted in size and profile, and replaced, thereby adjusting the cavity without disturbing the electronic components or MMIC's which are secured to the back plate. The foregoing eliminates the restrictions imposed by the prior use of mouseholes and avoids the need for rebuilding the entire housing.
The invention relates to millimetric packaged electronic components for applications at high frequencies greater than 45 GHz. According to the invention, to facilitate the design of a system including MMIC chips working at these frequencies, it is proposed to use packages containing one or more chips, these packages making it possible to work at these frequencies and including two types of port: a port with transition by contactless electromagnetic coupling providing a connection with an antenna at the high working frequency F via a waveguide; and a port with microstrip or coaxial line type transition enabling a connection at a subharmonic frequency F/N (preferably N=6 or 4 or, if necessary, 3) of the working frequency.
A first waveguide groove is formed in a sidewall of a main casing housing a first circuit board, and a second waveguide groove is formed in a sidewall of a sub-casing hermetically housing a second circuit board such that the first waveguide groove is in continuous connection with the second waveguide groove. Further, a lid is attached to the sidewall of the main casing so as to cover the first and the second waveguide grooves, and a probe provided on the second circuit board protrudes into the second waveguide groove. In addition, an inclined plane is formed at an end of the first waveguide groove so as to be in continuous connection with a through-hole provided in the lid.
A waveguide assembly including a waveguide, a backshort member, and an adjustment member, where the adjustment member is capable of receiving or input and transforming it into an output that causes the backshort member to be displaced in response to said input.
A waveguide/planar line converter is provided which enables a simplified assembling operation and accurate positioning of a signal line. The waveguide/planar line converter includes a housing having a waveguide and a waveguide/planar line conversion substrate with a signal line propagating high frequency signals formed on one main surface side and a ground formed on the other main surface side, wherein one end portion of the signal line of the waveguide/planar line conversion substrate is located in such a manner so as to protrude into the waveguide, and the waveguide/planar line conversion substrate is arranged on the whole top surface of the housing so as to cover the mouth of the waveguide.
