An apparatus for connecting a cylindrical ingot to a support plate includes means for measuring a crystal orientation of the ingot based on a diffraction of x-rays, means for rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, means for adhering an intermediate plate to the ingot, means for adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and means for attaching the support plate to the intermediate plate.
RELATED APPLICATIONS
The present application is a divisional of U.S. application Ser. No. 08/753,387 entitled SYSTEM AND METHOD FOR PROCESSING INGOTS filed Nov. 26, 1996.
Priority Data
Nov 30, 1995 [JP] 7-338279 Jul 31, 1996 [JP] 8-201653 Oct 31, 1996 [JP] 8-290913
An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.
An apparatus and a method for determining the orientation of a crystallographic plane (100) relative to a crystal surface (2) are provided, in which the orientation is free from errors of adhesion of the crystal or contamination of the holders for the crystal. For this purpose, the angle which the crystal surface to be measured forms with a reference axis and the angle which the crystallographic plane forms with the reference axis are measured and subtracted. In a wire sawing apparatus with an X-Y positioning unit, next the desired correction is made with the aid of measurement of the orientation and at the same time the crystal is displaced in horizontal and vertical positions. As a result, there remains a further degree of freedom of rotation of the crystal in the cutting plane for achieving a cut which is free from forces perpendicular to the feed direction and wire direction, so that no tool deflection takes place or the cutting forces are minimal. Further, the precision of orientation is increased.
