The performance of capacitor-grade tantalum powder that is vacuum packaged is enhanced. Preventing contact with air reduces the quantity of oxygen that passes through the oxide film and dissolves in the substrate. Lower oxygen in the powder can lower DC leakage in the capacitor made from the powder. Over a 4-month period, vacuum/argon packaging reduces oxygen pick-up in a 50K-class powder by over 200 ppm compared with the same powder stored in conventional packaging.
