This patent describes a method of manufacturing a thermoelastic rotary impeller ink jet print head wherein an array of nozzles are formed on a substrate utilizing planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The print heads can be formed utilizing standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.
A method of manufacturing a shape memory alloy ink jet printhead wherein an array of nozzles are formed on a substrate utilizing planar monolithic deposition, lithographic and etching processes. Multiple ink jet heads are formed simultaneously on a single planar substrate such as a silicon wafer. The printheads can be formed utilizing standard VLSI/ULSI processing and can include integrated drive electronics formed on the same substrate. The drive electronics preferably being of a CMOS type. In the final construction, ink can be ejected from the substrate substantially normal to the substrate plane.
A method for producing blocks on a support that are designed to be removed by scratching. An ink jet printing technique is used to produce the blocks. The ink used is of the type with phase change. The method can be used to form a support containing an information or a graphic design on its surface and a scratchable block masking the information or graphic design. The scratchable block consists of juxtaposed and/or superposed dots of material. The method is particularly applicable to smart cards.
