Curable suspensions of an epoxy resin formulation comprising a) a storage-stable suspension of an epoxy resin and a toughener suspended therein which contains no groups that react with a curable epoxy resin system, b) dicyandiamide, a polycarboxylic acid, a polycarboxylic anhydride, a polyamine, a polyaminoamide, an amino group-containing adduct of an amine and a polyepoxide, a polyol or a catalytically curing hardener, and, as optional components, c) a curing catalyst, conventional fillers or reinforcing materials, are particularly suitable for use as casting resins, laminating resins or adhesives.
A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40.degree. C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120.degree. C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent. The light and heat curable liquid crystal sealing agent composition is employable in one drop fill, is excellent in properties of a cured product particularly after first-stage light curing, achieves stable cell gap after cell gap formation, permits prevention of contamination of the liquid crystal in second-stage heat curing, is excellent in curing properties in shaded area, and shows superior bonding reliability.
An encapsulating epoxy resin composition comprising an epoxy resin which is liquid at normal temperature, a curing agent containing an aromatic amine which is liquid at normal temperature, an inorganic filler, and rubber particles; an encapsulant comprising this composition; and an electronic device having an encapsulating member comprising a cured product of this encapsulant.
A thermoplastic molding composition comprising a grafted acrylate rubber (ASA) and a gloss reducing agent and a process for making the same are disclosed. The gloss reducing agent is the reaction product of (i) an epoxidized grafted rubber having two or more epoxy groups in its graft phase and (ii) a compound having two or more terminal primary amine groups per molecule The gloss reducing agent may be either incorporated in ASA as the reaction product of (i) and (ii) or, in the altemative, formed upon the reaction of (i) with (ii) in the course of the thermal processing of the a blend containing ASA, (i) and (ii).
A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.
The present invention relates to a prepreg laminate, constructed from a first prepreg; a second prepreg; and a thermoplastic layer therebetween. In the inventive laminate, at least one of the first prepreg or the second prepreg is made from a matrix resin comprising a benzoxazine-containing composition.
