A method for manufacturing multilayer ceramic electronic components includes the steps of removing organic materials from multilayer ceramic bodies having internal electrodes and ceramic layers, and then sintering the multilayer ceramic bodies. After finishing the removing step, it is preferable that the amount of the remaining organic materials in the multilayer ceramic body is 0.5 to 8.5 weight %, more preferably 1.0 to 5.0 weight %. The removing process may be performed in a neutral, a reductive or inert atmosphere. It is also preferable that the organic materials removing temperature of the internal electrodes are controlled to be higher than that of the ceramic layer.

Products which are to be traversed vertically by a flow of hot gases, such as ceramic supports of honeycomb structure, are supported in an oven by novel structure during baking. The novel structure is a thin horizontal plate of porous ceramic foam. But because this plate of porous ceramic foam is fragile, it is specially supported by a plurality of parallel horizontal bars. These horizontal bars can be of either or both of two types: in one type, the bars are received in grooves on the underside of the porous ceramic foam plate and project below the lower surface of the plate. In another form, the bars pass through bores in the ceramic plate. When both types of bars are used, the bars of one type are perpendicular to the bars of the other type. In all cases, the bars rest on support structure of the oven, so that the plate of porous ceramic foam does not touch this support structure.