Testing system for evaluating integrated circuits, a burn-in testing system, and a method for testing an integrated circuit

Claims

What is claimed is:

1. A burn-in testing system for evaluating a circuit under test, the system comprising:

a burn-in board having a plurality of receptacles, at least one of which is configured to receive the circuit under test and to supply power thereto;

test interface circuitry supported by the burn-in board and coupled to the receptacles, the test interface circuitry including a transmitter and is a receiver;

a test compartment selectively receiving the burn-in board; and

an interrogator unit supported by the test compartment and having a radio communication range extending to the test interface circuitry, the interrogator unit being configured to send commands through the receiver to the test interface circuitry to exercise the circuit under test via radio communication and to receive responses to the commands from the transmitter via radio communication.

2. A burn-in testing system in accordance with claim 1, wherein the test interface circuitry is mounted to the burn-in board.

3. A burn-in testing system in accordance with claim 1, further comprising power conductors supported by the burn-in board, coupled to the receptacles and configured to be coupled to a power supply to power the circuit under test during burn-in testing, wherein the power conductors comprise conductive traces formed on the burn-in board.

4. A burn-in testing system in accordance with claim 1, further comprising data lines supported by the burn-in board, coupled between the receptacles and the test interface circuitry and configured to exchange information between the test interface circuitry and the circuit under test.

5. A burn-in testing system in accordance with claim 1, further comprising conductive traces formed on the burn-in board and configured to couple the receptacles to the test interface circuitry.

6. A burn-in testing system in accordance with claim 1, wherein the circuit under test includes operational circuitry, and wherein the test interface circuitry cycles the operational circuitry according to the commands from the interrogator unit.

7. A burn-in testing system in accordance with claim 6, wherein the interrogator unit is configured to provide an identification code as part of the interrogating information, wherein the test interface circuitry includes ID labels assigned to respective receptacles, and wherein the test interface circuitry is configured to compare the identification code provided by the interrogator unit with the ID label of a receptacle of the plurality of receptacles corresponding to the circuit under test, the test interface circuitry being configured to test cycle the operational circuitry when the identification code matches the ID label.

8. A burn-in testing system in accordance with claim 1, wherein the test interface circuitry is separately coupled to respective ones of the plurality of receptacles such that the interrogator, in communication with the test interface circuitry, can select the circuit under test for test cycling.

9. A burn-in testing system in accordance with claim 1, wherein ones of the plurality of receptacles respectively comprise sockets configured to receive an integrated circuit comprising the circuit under test.

10. A burn-in testing system in accordance with claim 1, wherein at least one of the plurality of receptacles is configured to receive an integrated circuit defining the circuit under test.

11. A testing system for evaluating integrated circuits, the testing system comprising:

a test chamber;

an interrogator unit having a transmitter having a radio communication range and configured to transmit interrogating information within the chamber via radio communication;

a receiver configured for communications with the transmitter; and

a burn-in board selectively received within the chamber and remotely from the interrogator unit, but within the radio communication range, the burn-in board including a plurality of receptacles configured to receive respective individual integrated circuits and to supply power thereto, the burn-in board supporting the receiver, the burn-in board having burn-in test conductors coupling the receiver to respective ones of the plurality of receptacles, the plurality of receptacles including sockets configured to electrically couple the respective integrated circuits to the burn-in test conductors.

12. A testing system in accordance with claim 11, further comprising test interface circuitry supported by the burn-in board, the test interface circuitry including the receiver.

13. A testing system in accordance with claim 11, wherein the testing system is configured to perform dynamic testing.

14. A testing system in accordance with claim 11, wherein the testing system is configured to perform dynamic testing and wherein the integrated circuits are cycled on and off during a period of time greater than twelve hours and less than thirty-six hours.

15. A testing system in accordance with claim 11, wherein the test chamber includes a burn-in oven and the testing system is configured to perform dynamic testing including cycling the integrated circuits on and off during a period of time greater than twelve hours and less than thirty-six hours while the oven heats the chamber to a temperature greater than 100 degrees Celsius.

16. A testing system in accordance with claim 11, wherein the test chamber includes a burn-in oven and the testing system is configured to perform dynamic testing including cycling the integrated circuits on and off during a period of time of at least twelve hours while the oven heats the chamber to a temperature greater than 100 degrees Celsius.

17. A testing system in accordance with claim 12, wherein the test interface circuitry is formed on the burn-in board.

18. A testing system in accordance with claim 11, wherein the testing system is configured to perform static testing.

19. A testing system in accordance with claim 11, further comprising power conductors configured to couple respective ones of the plurality of receptacles to a power source to supply power to the integrated circuits during burn-in testing wherein the power conductors extend at least partially along the burn-in board.

20. A testing system in accordance with claim 11, further comprising:

power conductors formed on the burn-in board and configured to couple respective ones of the plurality of receptacles to a power source to supply power to the integrated circuits during burn-in testing;

a burn-in oven configured to heat the test chamber during burn-in testing; and

a power source accessible from the test chamber, wherein the power conductors are configured to be removably coupled to the power source.

21. A testing system in accordance with claim 11, further comprising:

power conductors formed on the burn-in board and configured to supply power to the integrated circuits during burn-in testing; and

a power source to which the power conductors are selectively coupled, the power source being configured to supply to the integrated circuits a voltage higher than a normal operating voltage of the respective integrated circuits.

22. A testing system in accordance with claim 11, wherein the test interface circuitry is configured to be separately coupled to the respective ones of the plurality of receptacles for individualized testing of integrated circuits.

23. A testing system for evaluating integrated circuits, the testing system comprising:

a test chamber;

an interrogator unit having an optical transmitter having an optical communication range, the interrogator unit being configured to optically transmit interrogating information into the chamber;

an optical receiver configured to communicate with the optical transmitter; and

a burn-in board selectively received within the test chamber within the optical communication range, the burn-in board including a plurality of receptacles configured to receive respective individual integrated circuits and to supply power thereto the burn-in board supporting the optical receiver, the burn-in board having burn-in test conductors configured to couple the optical receiver to respective receptacles, the receptacles including sockets configured to electrically couple the respective integrated circuits to the burn-in test conductors.

24. A testing system in accordance with claim 23, further comprising test interface circuitry supported by the burn-in board, the test interface circuitry including the optical receiver.

25. A method for testing an integrated circuit including operational circuitry, the method comprising:

providing a burn-in board including test interface circuitry and a plurality of receptacles configured to electrically interface the test interface circuitry with the operational circuitry in the integrated circuits and to supply power thereto;

providing an interrogator unit;

placing the integrated circuit in one of the plurality of receptacles;

heating the integrated circuit;

transmitting interrogating information from the interrogator unit to the test interface circuitry on the burn-in board via radio communication;

testing the operational circuitry according to the interrogating information;

coupling test data from the operational circuitry to the interrogator unit; and

determining whether the integrated circuit has a defect.

26. A method in accordance with claim 25, further comprising:

marking respective ones of the plurality of receptacles with individual ID labels;

transmitting an identification code from the interrogator unit;

comparing the identification code with the ID label; and

test cycling the operational circuitry of an integrated circuit in a given receptacle only when the identification code matches the individual ID label of the given receptacle.

27. A method for testing an integrated circuit including operational circuitry, the method comprising:

providing a burn-in board including test interface circuitry and having a plurality of receptacles configured to receive integrated circuits and to electrically interface the operational circuitry in the integrated circuits with the test interface circuitry and to supply power thereto;

providing an interrogator unit;

placing the integrated circuit in one of the receptacles;

optically transmitting interrogating information from an optical transmitter having an optical communication range and contained in the interrogator unit to the test interface circuitry on the burn-in board;

testing the operational circuitry according to the interrogating information;

optically transmitting test data output by the operational circuitry back to the interrogator unit; and

determining from the test data whether the integrated circuit has a defect.

28. A method in accordance with claim 27, further comprising:

marking respective ones of the plurality of receptacles with individual ID labels;

transmitting an identification code from the interrogator unit;

comparing the identification code with the individual ID labels; and

test cycling the operational circuitry of an integrated circuit in a given receptacle only when the identification code matches the individual ID label of the given receptacle.

29. A method in accordance with claim 27, further comprising heating the integrated circuit during testing.

30. A method for testing an integrated circuit including operational circuitry, the method comprising:

providing a burn-in board including test interface circuitry and a plurality of receptacles configured to receive integrated circuits and to electrically interface the operational circuitry in the integrated circuits with the test interface circuitry and to supply power thereto;

providing an interrogator unit;

placing the integrated circuit in one of the receptacles;

transmitting interrogating information from the interrogator unit to the test interface circuitry on the burn-in board via radio communication; and

testing the operational circuitry according to the interrogating information.

31. A method for testing an integrated circuit including operational circuitry, the method comprising:

providing a burn-in board including test interface circuitry and having a plurality of receptacles configured to receive integrated circuits, to electrically interface the operational circuitry in the integrated circuits with the test interface circuitry and to supply power thereto;

providing an interrogator unit;

placing the integrated circuit in one of the receptacles;

optically transmitting interrogating information from an optical transmitter having an optical communication range in the interrogator unit to the test interface circuitry on the burn-in board; and

testing the operational circuitry according to the interrogating information.

32. A method for testing an integrated circuit including operational circuitry, comprising:

providing an interrogator unit;

placing the integrated circuit in a receptacle on a burn-in board having test interface circuitry coupled to the receptacle, the receptacle supplying power to the integrated circuit;

transmitting interrogating information from the interrogator unit to the test interface circuitry on the burn-in board via radio communication; and

testing the operational circuitry according to the interrogating information.

33. A method in accordance with claim 32, further comprising:

marking the receptacle with an ID label;

transmitting an identification code from the interrogator unit;

comparing the identification code with the ID label; and

testing the operational circuitry of the integrated circuit in the receptacle only when the identification code matches the ID label of the receptacle.

34. A method for testing an integrated circuit including operational circuitry, comprising:

providing an interrogator unit;

placing the integrated circuit in a receptacle on a burn-in board having test interface circuitry coupled to the receptacle, the receptacle supplying power to the integrated circuit;

optically transmitting interrogating information from an optical transmitter having an optical communication range contained in the interrogator unit to the test interface circuitry on the burn-in board; and

testing the operational circuitry according to the interrogating information.

35. A method in accordance with claim 34, further comprising heating the integrated circuit.

36. A burn-in testing system for evaluating a circuit under test, comprising:

a burn-in board configured to receive and supply electrical power to the circuit under test;

test interface circuitry supported by the burn-in board and configured to be coupled to the circuit under test, the test interface circuitry including a transmitter and receiver;

a test compartment selectively receiving the burn-in board; and

an interrogator unit supported by the test compartment and having a radio communication range extending to the test interface circuitry, the interrogator unit being configured to exchange signals with the circuit under test via radio communication with the transmitter and receiver.

37. A burn-in testing system in accordance with claim 36, wherein the test interface circuitry is mounted on the burn-in board.

38. A burn-in testing system in accordance with claim 36, further comprising a plurality of receptacles on the burn-in board and configured to receive the circuit under test, and coupled to the test interface circuitry.

39. A burn-in testing system in accordance with claim 38, further comprising conductive traces on the burn-in board coupling the receptacles to the test interface circuitry.

40. A burn-in testing system in accordance with claim 38, further comprising power conductors supported by the burn-in board, configured to be coupled to the circuit under test and configured to be coupled to a power supply to power the circuit under test during burn-in testing, the power conductors comprising conductive traces formed on the burn-in board.

41. A testing system for evaluating integrated circuits, comprising:

a test chamber;

an interrogator unit having a transmitter having a radio communication range, the interrogator unit being configured to transmit interrogating information within the chamber via radio communication;

a receiver configured for communications with the transmitter; and

a burn-in board selectively received within the test chamber within the radio communication range, the burn-in board being configured to support respective individual integrated circuits, the burn-in board supporting the receiver, the burn-in board having burn-in test conductors configured to couple the receiver to respective integrated circuits and to supply electrical power to the integrated circuits.

42. A testing system in accordance with claim 41, further comprising test interface circuitry supported by the burn-in board, the test interface circuitry including the receiver.

43. A testing system in accordance with claim 42, the testing system being configured to perform dynamic testing.

44. A testing system in accordance with claim 42, the testing system being configured to perform dynamic testing wherein the integrated circuits are cycled on and off during a period of time greater than twelve hours and less than thirty-six hours.

45. A testing system in accordance with claim 42, wherein the test chamber includes a burn-in oven and the testing system is configured to perform dynamic testing wherein the integrated circuits are cycled on and off during a period of time of at least twelve hours while the burn-in oven heats the chamber to a temperature greater than 100 degrees Celsius.

46. A testing system in accordance with claim 42, wherein the test interface circuitry is secured to the burn-in board.

47. A testing system in accordance with claim 42, wherein the testing system is configured to perform static testing.

48. A testing system in accordance with claim 41, further comprising power conductors formed on the burn-in board and configured to couple respective integrated circuits to a power source to supply power to the integrated circuits during burn-in testing, the power conductors extending at least partially along the burn-in board.

49. A testing system in accordance with claim 48, wherein the test chamber includes a burn-in oven configured to heat the integrated circuits during testing and wherein the power conductors are configured to be removably coupled to the power source.

50. A testing system in accordance with claim 41, further comprising a power source to which power conductors are selectively coupled, the power source being configured to supply the integrated circuits a voltage higher than a normal operating voltage of the respective integrated circuits.

51. A testing system in accordance with claim 41, wherein the test interface circuitry is separately coupled to the respective receptacles and is configured for individualized testing of the integrated circuits.