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Filling open through holes in a multilayer board    
United States Patent6204456   
Link to this pagehttp://www.wikipatents.com/6204456.html
Inventor(s)Lauffer; John M. (Waverly, NY); Markovich; Voya R. (Endwell, NY); Palomaki; Cheryl L. (Endicott, NY); Wilson; William E. (Waverly, NY)
AbstractMethods of filling apertures, for example, through holes, in substrates are provided. The methods utilize a dielectric film, preferably a photoimageable dielectric film, which is employed to fill the apertures and to form a dielectric film disposed above the substrate at the same time. As a result, the aperture fill material is the same as, and indeed continuous with, the dielectric film which is disposed on the substrate. The method employs the following steps: providing a substrate having apertures; providing a dielectric film disposed on the substrate covering the apertures, reflowing the dielectric film to flow into the apertures and to form a dielectric film adherent to the substrate, to provide a continuous dielectric extending from the dielectric film into the apertures. In certain embodiments, after filling, additional apertures, such as vias, are photoimaged in the dielectric film. Preferably the vias are then metallized, and circuitry formed atop the dielectric film.
   














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Drawing from US Patent 6204456
Filling open through holes in a multilayer board - US Patent 6204456 Drawing
Filling open through holes in a multilayer board
Inventor     Lauffer; John M. (Waverly, NY); Markovich; Voya R. (Endwell, NY); Palomaki; Cheryl L. (Endicott, NY); Wilson; William E. (Waverly, NY)
Owner/Assignee     International Business Machines Corporation (Armonk, NY)
Patent assignment
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Publication Date     March 20, 2001
Application Number     09/159,938
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     September 24, 1998
US Classification     174/262 29/852 174/265 174/266
Int'l Classification     H01R 009/09
Examiner     Gaffin; Jeffrey
Assistant Examiner     Cuneo; Kamand
Attorney/Law Firm     Hogg; William N.
Address
Parent Case    
Priority Data    
USPTO Field of Search     174/262 174/264 174/266 174/258 174/265 29/852 361/792 361/793 361/794 361/795
Patent Tags     filling open through holes multilayer board
   
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