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Method for testing semiconductor components    

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United States Patent6208157   
Link to this pagehttp://www.wikipatents.com/6208157.html
Inventor(s)Akram; Salman (Boise, ID); Hembree; David R. (Boise, ID); Farnworth; Warren M. (Nampa, ID); Gochnour; Derek (Boise, ID); Wood; Alan G. (Boise, ID); Jacobson; John O. (Boise, ID)
AbstractA system and method for testing semiconductor components are provided. The system includes: a test board, sockets mounted to the test board in electrical communication with test circuitry, and carriers mounted to the sockets for housing the components. The carriers include bases, and interconnects mounted thereon, having contact members configured to make temporary electrical connections with contacts on the components. In addition, the contact members on the interconnects can be shaped to perform an alignment function, and to prevent excessive deformation of the contacts on the components. The sockets include camming members and electrical connectors configured to electrically contact the carriers with a zero insertion force. During a test procedure, the bases and interconnects can remain mounted to the sockets on the test board, as the components are aligned and placed in electrical contact with the interconnects. However, different bases and interconnects can be mounted to the sockets for testing different types of components.
   














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Drawing from US Patent 6208157
Method for testing semiconductor components - US Patent 6208157 Drawing
Method for testing semiconductor components
Inventor     Akram; Salman (Boise, ID); Hembree; David R. (Boise, ID); Farnworth; Warren M. (Nampa, ID); Gochnour; Derek (Boise, ID); Wood; Alan G. (Boise, ID); Jacobson; John O. (Boise, ID)
Owner/Assignee     Micron Technology, Inc. (Boise, ID)
Patent assignment
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Company News
Publication Date     March 27, 2001
Application Number     09/298,769
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     April 23, 1999
US Classification     324/755 324/765
Int'l Classification     G01R 31//02
Examiner     Metjahic; Safet
Assistant Examiner     Tang; Minh
Attorney/Law Firm     Gratton; Stephen A.
Address
Parent Case     CROSS REFERENCE TO RELATED APPLICATIONS This application is a division of patent application Ser. No. 08/916,434 filed Aug. 22, 1997, U.S. Pat. No. 6,072,326.
Priority Data    
USPTO Field of Search     324/754 324/755 324/760 324/765 324/72.5 324/158.1
Patent Tags     testing semiconductor components
   
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 References Submit all comments and votes
 
*references marked with an asterisk below are user-added references
 U.S. References
 
Add a new US reference:  
ReferenceRelevancyCommentsReferenceRelevancyComments
6094058
Hembree

Jul,2000

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Wood

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Akram

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Wood

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Hembree

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6072326
Akram

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6060894
Hembree

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Farnworth

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Akram

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Hembree

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Akram

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Hembree

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Hembree

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Akram
324/758
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Akram
324/757
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Farnworth
324/755
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Farnworth
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Wood
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Hembree

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Akram
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Wood
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Market Size
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$2B - $5B
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$100M - $500M
$10M - $100M
$1M - $10M
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< $100K
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$0
 
$0   $2.5B   $5B   $7.5B   $10B

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Market Share
Estimate the percentage of the relevant market sector this invention will capture:
75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
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0%   25%   50%   75%   100%

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75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
[No votes]
0.0%
 
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[0 reasonable royalty comments]
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