A circuit and method for testing a semiconductor memory device using a row compression test mode is provided. The testing circuit includes at least one equalizer circuit for supplying a first voltage level to one of at least one true bitline or at least one complement bitline during a test mode; an equalizing line for coupling a plurality of equalizer circuits along a wordline; and a comparator for comparing a second voltage on the equalizing line during the test mode to a reference voltage, wherein if the second voltage is less than the reference voltage, the wordline is defective.

Integrated circuit devices are provided including a pair of differential I/O lines and a driver circuit. The driver circuit is configured to drive the pair of differential I/O lines responsive to a write command signal. First and second precharge circuits are also provided. The first precharge circuit is configured to precharge the pair of differential I/O lines to a first voltage during a first mode of operation responsive to an active command signal. The second precharge circuit is configured to precharge the pair of differential I/O lines to a second voltage, lower than the first voltage, during a second mode of operation responsive to the active command signal. Related methods of operating integrated circuit devices are also provided.

Precharge circuits comprises PMOS transistors Q6 and Q7 each connected between a bit line and a power source potential VDD, PMOS transistors Q2, Q5, Q8 and Q11 connected between respective bit line pairs, and PMOS transistors Q21 and Q23 connected between respective adjacent bit lines of adjacent bit line pairs, wherein the gate electrodes of the PMOS transistors are each connected to a precharge control signal line PCG. The defect caused by omission of transistors from the prior art circuits is compensated by the PMOS transistors Q21 and Q23, each of which is required to be provided for two bit line pairs. With this and transistors of adjacent unit precharge circuits are arranged in plain symmetry, there is no need to provide transistors to be directly connected between bit lines *B2 and B3, and an average number of PMOS transistors for each bit line pair is less than 2.5.

The present invention provides a semiconductor integrated circuit device equipped with a memory circuit, which realizes speeding up of its operation in a simple configuration or realizes high reliability and enhancement of product yields in a simple configuration. A memory cell is selected from within a memory array having a plurality of memory cells by a selector or selection circuit. MOSFETs constituting a precharge circuit provided for signal lines for transferring a read signal therefrom to a main amplifier are respectively brought to an on state based on a memory cell select start signal transferred to the selection circuit and brought to an off state prior to the transfer of the read signal from the memory cell to thereby complete precharging, whereby NBTI degradation at standby is avoided.

The present invention provides a semiconductor integrated circuit device equipped with a memory circuit, which realizes speeding up of its operation in a simple configuration or realizes high reliability and enhancement of product yields in a simple configuration. A memory cell is selected from within a memory array having a plurality of memory cells by a selector or selection circuit. MOSFETs constituting a precharge circuit provided for signal lines for transferring a read signal therefrom to a main amplifier are respectively brought to an on state based on a memory cell select start signal transferred to the selection circuit and brought to an off state prior to the transfer of the read signal from the memory cell to thereby complete precharging, whereby NBTI degradation at standby is avoided.