An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling oscillation to seal a small size of surface mounting type quartz oscillator or the like. A bonding face (1a) of a sealing metal cap (1) is positioned on a bonded face (2a) of a package substrate (2), and ultrasonic oscillations of different directions are simultaneously imparted in the bonding plane while a suitable load is applied from an upper or a lower part of the bonding portion to the plane in a vertical direction so that the sealing metal cap (1) and the package substrate (2) are welded and fixed to be sealed on the bonding face.
While fabricating a packaged semiconductor chip, a wire is bonded on a chip contact pad using a wire bonding machine. A bond head of the wire bonding machine is moved relative to the chip contact pad, thereby pulling a first length of the wire out of the wire bonding machine. Part of the wire passes through a space between a first outer edge of a first bearing race and a second outer edge of a second bearing race during the pulling of the first length. The wire is bonded on a lead. A first piezoelectric element is energized in the bond head, thereby causing it to expand and press against the first bearing race, which brakes the first bearing race and brakes the wire between the first and second races. The bond head is moved relative to the lead during the braking and severs the wire proximate to the lead.
Sealant 11 is supplied in advance to one or both of the electrical bonding areas 5,6 of the component 3 and the mounting surface 4, and as the component 3 is brought in contact with the mounting surface 4, the sealant 11 is compressed and filled therebetween in a required area. At the same time ultrasonic vibration is applied to the component 3 for generating friction between the electrical bonding areas 5, 6 of the component 3 and the mounting surface 4 in tight contact with each other, so that both electrical bonding areas 5, 6 are melted and ultrasonically bonded together, and thereby the component 3 is mounted on the mounting surface 4.
A tool head for attaching an electrical conductor on the contact surface of a substrate, comprising a vibration exciter for generating linear ultrasonic vibrations; a bonding tool that is able to contact the contact surface and/or the conductor, a contact pressure being able to be applied to the conductor in the direction of the contact point via the bonding tool, and the conductor is able to be welded onto the contact point with the aid of the ultrasonic vibrations able to be transmitted to the contact point and/or the conductor in this manner; and a vibration conductor absorbing the linear ultrasonic vibrations of the vibration exciter; a converter being provided between the vibration conductor and the bonding tool to convert the linear vibrations into radial vibrations in such a way that the bonding tool is able to be incited to rotary vibrations.
While fabricating a packaged semiconductor chip, a wire is bonded on a chip contact pad using a wire bonding machine. A bond head of the wire bonding machine is moved relative to the chip contact pad, thereby pulling a first length of the wire out of the wire bonding machine. Part of the wire passes through a space between a first outer edge of a first bearing race and a second outer edge of a second bearing race during the pulling of the first length. The wire is bonded on a lead. A first piezoelectric element is energized in the bond head, thereby causing it to expand and press against the first bearing race, which brakes the first bearing race and brakes the wire between the first and second races. The bond head is moved relative to the lead during the braking and severs the wire proximate to the lead.
