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System for testing semiconductor components having flexible interconnect    

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United States Patent6300782   
Link to this pagehttp://www.wikipatents.com/6300782.html
Inventor(s)Hembree; David R. (Boise, ID); Gochnour; Derek (Boise, ID)
AbstractA system for testing semiconductor components includes a testing apparatus, such as a test carrier for discrete components, or a wafer prober for wafer sized components The system also includes an interconnect for electrically engaging the components. The interconnect includes a thinned substrate, and first contacts on the substrate for electrically engaging second contacts on the components. The thinned substrate has a thickness that is substantially less than a thickness of the components being tested. The thinned substrate can flex upon application of a biasing force by the testing apparatus, permitting the first contacts to move in the z-direction to accommodate variations in the planarity of the second contacts.
   














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Drawing from US Patent 6300782
System for testing semiconductor components having flexible interconnect - US Patent 6300782 Drawing
System for testing semiconductor components having flexible interconnect
Inventor     Hembree; David R. (Boise, ID); Gochnour; Derek (Boise, ID)
Owner/Assignee     Micron Technology, Inc. (Boise, ID)
Patent assignment
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Company News
Publication Date     October 9, 2001
Application Number     09/872,434
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     June 4, 2001
US Classification     324/760 29/874 29/876 324/754 324/755 324/757 324/762 324/765 438/14
Int'l Classification     G01R 031/26 G01R 031/02 H01R 043/16 H01R 043/20
Examiner     Brown; Glenn W.
Assistant Examiner     Hamdan; Wasseem
Attorney/Law Firm     Gratton; Stephen A.
Address
Parent Case     CROSS REFERENCE TO RELATED APPLICATIONS This application is a division of patent application Ser. No. 09/756,626 filed on Jan. 8, 2001, U.S. Pat. No. 6,242,931, which is a division of patent application Ser. No. 09/304,227 filed on May 3, 1999, U.S. Pat. No. 6,263,566.
Priority Data    
USPTO Field of Search     324/760 324/765 324/757 324/762 324/755 324/754 29/874 29/876 438/14
Patent Tags     testing semiconductor components flexible interconnect
   
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