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Method for measuring the parameter of a rough film
   
Document Number
US Patent 6310688
Issued Date
October 30, 2001
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Abstract
A method for measuring the parameter of a rough film is presented in this invention. In which the optical property of a rough film is further defined by utilizing the characteristics of an optical instrument and silicon film, without disturbance from noise in measurement. Therefore, good or bad the rough film is can be detected effectively, further, a handy method can be offered to control the stability in the manufacturing process. The invention is performed by choosing a measuring light with wavelength in a certain range and an optical instrument, then comparing the result with a standard value to monitor the result of the manufacturing process of the rough film.
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Method for measuring the parameter of a rough film - US Patent 6310688 Drawing
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Number of Claims:
6
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Owner
Mosel Vitelic Inc. (Hsinchu,TW)
Published
October 30, 2001
Application Number
09/131,405
Filed
August 10, 1998
US Classification
356/369   356/600
Int'l Classification
G01B   11/06   (20060101)  
Examiner
Attorney/Law Firm
Priority Data
Jul 03, 1998 [TW] 87110759
USPTO Field of Search
356/371   356/394   356/445   356/446   356/447   356/448   356/369   356/237.1   356/237.2   356/237.3   356/237.4   356/237.5   356/600   257/309   257/534  
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The present invention provides SEM systems, SEM calibration standards, and SEM calibration methods that improved accuracy in critical dimension measurements. The calibration standards have features formed with an amorphous material such as amorphous silicon. Amorphous materials lack the crystal grain structure of materials such as polysilicon and are capable of providing sharper edged features and higher accuracy patterns than grained materials. The amorphous material can be bound to a silicon wafer substrate through an intermediate layer of material, such as silicon dioxide. Where the intermediate layer is insulating material, as is silicon dioxide, the intermediate layer may be patterned with gaps to provide for electrical communication between the amorphous silicon and the silicon wafer. Charges imparted to the amorphous silicon during electron beam scanning may thereby drain to the silicon wafer rather than accumulating to a level where they would distort the electron beam.

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