A packaged toy is provided in which toy egg sets of nested hollow toy eggs are held within a modular transparent egg carton. The modular transparent egg carton has a tray which holds the toy egg sets and a lid with a ceiling and a circumnavigating lip defining a depression in which the tray of a modular transparent egg carton is adapted to be located. A method of packaging a toy is provided in which plural toy egg sets are located within a modular transparent egg carton to form a matrix of packaged toys.
A method for fabricating a protective structure for bond wires of a semiconductor device assembly which includes sequentially fabricating one or more layers of the protective structure. After a first layer is formed, each subsequent layer is superimposed upon, contiguous with, and mutually adhered to an underlying layer of the protective structure. Such structure may be used to protect the bond wires of a test apparatus, which connect the contact pads of a carrier substrate of the test apparatus to corresponding bond pads of a test substrate. In addition, a fence member may be assembled with or formed on the test substrate to align and receive a semiconductor device and, thereby, to facilitate assembly of the semiconductor device with the test substrate. The fence member can be formed integrally with the protective structures or secured over the protective structures. Stereolithographic processes may be used to fabricate the fence member.
