Electronics packages having a primary metallic material, such as a titanium metallic material, metallurgically bonded to one or more secondary regions within the primary metallic material, the composite regions having desirable thermal conductivity properties and having a coefficient of thermal expansion ("CTE") that generally matches the CTE of the primary metallic material are provided. Electronics packages comprising titanium having heat sinks comprising a metal matrix material such as aluminum silicon carbide or a composite metallic structure such as titanium aluminide/copper, are described. Methods for manufacturing electronics packages having a composite structure are also disclosed.
A hermetically sealed package for electronic circuit components includes a generally hollow, titanium body, having a reduced thickness bottom wall/floor, whose interior surface is laminated with a relatively low mass, insert, upon which electronic circuit components are mounted. The insert has a high thermal conductivity and a low coefficient of thermal expansion, approximate to that of the housing body.
Methods and apparatus for hermetically sealing an optical fiber in a feedthrough connection. In brief overview, the optical fiber is mounted in a housing whose physical properties differ from that of the fiber by utilizing a structure in accordance with the present invention. The structure, typically in transition bushing form, is formed from at least two materials, such that the physical properties of a first material are selected to match the physical properties of the optical fiber, and the physical properties of a second material are selected to match physical properties of the housing. When the matched physical properties are the coefficients of thermal expansion (CTE) of the fiber and the housing, the result is a fiber optic mounting that remains hermetically sealed despite changes in ambient temperature that would typically induce stresses in the seal, potentially causing its failure.
A radiator plate includes a metallic matrix and a dispersant. The metallic matrix exhibits a predetermined coefficient of thermal expansion. The dispersant is dispersed in the metallic matrix, and exhibits a coefficient of thermal expansion being smaller than that of the metallic matrix. The radiator plate has a heat-receiving surface, on which an electric device serving as a heat generator is disposed, and a heat-radiating surface for radiating heat received from the heat-receiving surface. The dispersant is dispersed more on the heat-receiving-surface side than on the heat-radiating-surface side. Thus, the radiator plate is inhibited from warping, and is good in terms of the dimensional stability as a final product. Moreover, the thermal resistance is diminished between the heat-receiving surface and the heat-radiating surface. Accordingly, the heat-radiating ability of the radiator plate is secured. Also disclosed is a process for manufacturing the radiator plate.
A heat sink buffer 10 is provided, including a backplate 20 defining a heat transfer passage 24. A thermally conductive buffer element 22 is positioned within and secured to the heat transfer passage 24 to provide a thermal conduit through the backplate 20.
A hermetic sealing approach involves welding an Aluminum cover onto a low-cost Aluminum housing. According to an example embodiment of the present invention, a metal housing having a base and sidewalls extending upward therefrom is adapted to receive and couple to an HDD arrangement. The metal housing is formed using material and processing (e.g., cold formed or die cast Aluminum) that are relatively inexpensive. A feedthrough arrangement including a plurality of communication pins extends through an opening in the base and is coupled thereto, with the communication pins adapted to pass signals between the inside and the outside of the metal housing. A metal cover is welded to an upper portion of the sidewalls and, with the feedthrough arrangement, hermetically seals the metal housing.
