A method of non-intrusive, inductive proximity sensing of a target through a conductive barrier comprises the steps of: disposing an inductive proximity sensor on one side of a barrier of conductive material; disposing a target on the other side of the barrier; determining an appropriate drive frequency for operating the proximity sensor based on the conductive material and thickness of the barrier; and operating the proximity sensor with the appropriate drive frequency to non-intrusively sense the proximity of the target through the conductive barrier. The method may include the steps of: varying the gap between the target and proximity sensor over a gap range; measuring the inductive output of the proximity sensor at the appropriate drive frequency and different gaps to obtain inductive output measurements at the different gaps; determining the operating induction bandwidth of the proximity sensor operated at approximately the appropriate drive frequency from the inductive output measurements at the different gaps; and using the determined induction bandwidth for proximity sensing of the target through the conductive barrier. The gap range may be based on a sensor/target gap variation during actuation for a particular application.

A proximity sensor assembly includes a multilayer printed wiring board proximity sensor, the proximity sensor being operable as either a variable-reluctance sensor or an eddy current loss sensor. The proximity sensor includes a plurality of layers configured to form at least one wound coil disposed about at least a portion of a core. The coils are electrically driven to generate an alternating magnetic field such that the inductance of the coils changes when a permeable or conductive object is moved in relation to the magnetic field. The change in inductance is recognized and used to detect the proximity and presence of an object relative to the sensor.

A sensor device includes the ability to determine part presence and at least one physical characteristic of the part. A drive coil and sense coil are arranged so that a voltage applied across the drive coil causes a response in the sense coil, which is influenced by the presence of the item of interest. In a first mode, a controller determines whether the item is present by determining an amount of coupling between the drive coil and the sense coil, which is indicative of whether a part is present near the sense coil. In a second mode, the controller determines an amount of magnetic flux that is indicative of a thickness of the material. In another mode, constant current applied to the drive coil instigates a voltage across both coils. The amplitude of the sense coil voltage and a phase shift of the sense coil voltage relative to the drive coil voltage provides material thickness information.

An inductive proximity sensor for sensing the presence of target based on a change of inductance in the sensor. The sensor includes a coil and a core formed of a permeable material so as to form an electromagnetic field when the coil is electrically driven. The core has a base, a central post, an outer wall, and at least one slot. The central post extends distally from the base and through the coil and defines a distal end. The outer wall extends distally from the base and around the coil and also defines a distal end. The slot or slots are for enhancing the performance of the sensor by reducing eddy current losses in the core. Each slot extends at least partially along a path defined from the distal end of the outer wall to the base and from the base to the distal end of the central post.

A method of fabricating a multilayer wiring board proximity sensor includes forming a laminate, and fabricating a plurality of through-conductors through the layers of the laminate. The laminate has a plurality of layers including one or more core layers and a plurality of coil layers. Each core layer includes a core pattern formed of a permeable material, and each coil layer comprises at least one coil trace formed of a conducting material. Thus, the through-conductors may be fabricated through the layers of the laminate such that the coil traces are interconnected by the through-conductors to thereby form one or more coils disposed about at least a portion of the core patterns of the core layers.