There is provide a polishing member including photocatalyst particles that exhibit photocatalysis on light irradiation, and a support material that supports the photocatalyst particles. There is also provided a method of manufacturing a semiconductor device, including polishing a surface of a workpiece that is to be used as at least a portion of the semiconductor device with the polishing member with a fluid interposed between the polishing member and the surface of the workpiece while performing light irradiation onto the polishing member.

A method for cleaning a surface of semiconductor wafer after chemical mechanical polishing in accordance with the present invention comprises the steps of: (1) providing a semiconductor wafer having a surface to be treated; (2) applying a photocatalyst containing solution to the surface, the solution having a plurality of photocatalyst particles; and (3) applying light to the surface, the light being adapted to activate the photocatalyst particles.

A method of fabricating a semiconductor device includes a polishing process of a substrate, wherein the polishing process includes the steps of applying a chemical mechanical polishing process to the substrate on a polishing pad while using slurry, and conditions a surface of the polishing pad, the conditioning step including the step of grinding the surface of said polishing pad by at least first and second conditioning disks of respective, different surface states.

Capsulated abrasive compositions and a polishing pad using the same. More specifically, a polishing pad coated with compositions, which contain a capsulated abrasive, thereby used for planarizing interlayer insulating film formed on a semiconductor substrate by chemical mechanical polishing.

There is provided a method of manufacturing a semiconductor device, including irradiating a chemical mechanical polishing slurry with light on applying a chemical mechanical polishing treatment using the slurry to a polishing section of a target substrate to be polished, the slurry containing a dispersion medium and abrasive particles dispersed in the dispersion medium and exhibiting a photocatalytic function upon irradiation with light.