A method and system for use in wafer fabrication systems. The method and system capture an evolving wafer fabrication system by mapping at least one interaction between a selected at least one integral part associated with the wafer fabrication system and at least one other integral part associated with the wafer fabrication system.
CROSS-REFERENCE
The present invention is related to subject matter disclosed in the following co-pending application: 1. U.S. patent application Ser. No. 09/352,984 entitled, "Identifying Relationships Among Constituent Parts Of A Wafer Fabrication System", naming Timothy C. Dean as the inventor, filed substantially contemporaneously with the present application and incorporated by reference herein in its entirety; and 2. U.S. patent application Ser. No. 09/353,687 entitled, "Identifying Wafer Fabrication System Impacts Resulting From Specified Actions", naming Timothy C. Dean as the inventor, filed substantially contemporaneously with the present application and incorporated by reference herein in its entirety.
A method and system for use in wafer fabrication systems. The method and system identify relationships among constituent parts of a wafer fabrication system by generating a presentation of at least one relationship between an identified at least one integral part associated with the wafer fabrication system and at least one other integral part associated with the wafer fabrication system.
A method and system for use in wafer fabrication systems. The method and system identify wafer fabrication system impacts resulting from specified actions by specifying at least one action related to at least one integral part associated with the wafer fabrication system, and generating a presentation of at least one impact upon at least one integral part associated with the wafer fabrication system arising from the at least one action related to the at least one integral part associated with the wafer fabrication system.
