A process for manufacturing packaging (12) with good barrier properties against passage of water vapor and gases is such that recesses are shape-formed in a film-shaped material (22) to act as containers (26) to accommodate contents. After cutting the shape-formed film into individual units of packaging (12), these are coated in vacuum with materials exhibiting the desired barrier properties. A device for carrying out the process comprises a shaping station (14) for shape-forming the containers (26) from the film-shaped material (22), a cutting station (16) for cutting the packaging (12) out of the shape-formed, film-shaped material (22), and a vacuum-coating station (18) for coating the packaging (12). The process and the device make it possible to manufacture e.g. light-transparent blister packs within a packaging line, whereby the good barrier properties against passage of water vapor and gases can be achieved using relatively cost-favorable starting materials.
The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed with the formable sheet via attachment tabs that are positioned along one or more edges of the EMI/RFI shield.
Apparatus and methods for coating a substrate. In an exemplary embodiment, the apparatus are used to create a metallized substrate for use as an EMI/RFI shield. The apparatus typically includes a movable processing apparatus that is movable orthogonal to the substrate to treat the substrate. The processing apparatus can include a surface preparation assembly, a heating assembly, a thermoforming assembly, a metallizing assembly, a cutting assembly, or the like.
