A polishing pad conditioner cleaning method and an apparatus for effectively removing particles from a polishing pad conditioner. The polishing pad conditioner is immersed into a cleaning liquid contained in a cleaning bath. The cleaning liquid is continuously supplied into the cleaning bath. An inert gas is injected into the cleaning liquid from a bottom of the cleaning bath. The injected inert gas bubbles the cleaning liquid, so that the particles sticking to the polishing pad conditioner are removed and overflow from the cleaning bath. The polishing pad conditioner is effectively cleaned, so that formation of particles and scratches on a wafer are reduced when a polishing process is subsequently carried out using the cleaned polishing pad conditioner.
A chemical collection assembly and a method for using the assembly such that a chemical-mechanical polishing (CMP) pad used in the manufacture of semiconductor wafers can be assessed for cleanliness. The method involves delivering solvent from the assembly's reservoir to an enclosed volume over the CMP pad. The solvent then brings contaminants imbedded on the CMP pad into solution. This solution is then drawn back up from the enclosed volume wherefrom a sample of the solution can be taken. That sample is then analyzed for the level of contaminants present therein, and the analysis is compared to a pre-determined level of cleanliness to determine whether the CMP pad should or should not continue to be used for semiconductor wafer manufacturing.
A chemical collection assembly and a method for using the assembly such that a chemical-mechanical polishing (CMP) pad used in the manufacture of semiconductor wafers can be assessed for cleanliness. The method involves delivering solvent from the assembly's reservoir to an enclosed volume over the CMP pad. The solvent then brings contaminants imbedded on the CMP pad into solution. This solution is then drawn back up from the enclosed volume wherefrom a sample of the solution can be taken. That sample is then analyzed for the level of contaminants present therein, and the analysis is compared to a pre-determined level of cleanliness to determine whether the CMP pad should or should not continue to be used for semiconductor wafer manufacturing.
