There is provided a transistor, which includes a deoxyribonucleic acid molecule or a deoxyribonucleic acid molecule aggregate as a part of structural materials, has a source electrode member, a drain electrode member and a gate electrode member, in which at least one of three electrode members connects to the deoxyribonucleic acid molecule or deoxyribonucleic acid molecule aggregate. ##STR1##
Described herein are a molecular memory obtained using DNA strand molecular switches and carbon nanotubes, and a manufacturing method thereof. In particular, the nonvolatile memory is manufactured according to an architecture that envisages the use of carbon nanotubes as electrical connectors and DNA strands as physical means on which to write the information. In other words, the nonvolatile memory is made by means of a set of molecular DNA strand switches, the addressing of which is controlled by molecular wires made up of carbon nanotubes.
Embodiments of methods in accordance with the present invention provide three-dimensional carbon nanotube (CNT) integrated circuits comprising layers of arrays of CNT's separated by dielectric layers with conductive traces formed within the dielectric layers to electrically interconnect individual CNT's. The methods to fabricate three-dimensional carbon nanotube FET integrated circuits include the selective deposition of carbon nanotubes onto catalysts selectively formed on a conductive layer at the bottom of openings in a dielectric layer. The openings in the dielectric layer are formed using suitable techniques, such as, but not limited to, dielectric etching, and the formation of ring gate electrodes, including spacers, that provide openings for depositing self-aligned carbon nanotube semiconductor channels.
An apparatus including an interface having a number of nanostructures is described. The apparatus comprises heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface a substrate has a number of nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device.