A method for packaging organic electroluminescent (EL) elements comprises the steps including: forming a plurality of organic EL devices on a transparent substrate; laying a plurality of binding layers on a plastic laminated board to form a plastic package laminated board; forming a plurality of cavity domains on the plastic laminated board to serve for a plurality of package cans; and binding a lateral face of the package can. By doing the above said, the organic EL devices are packaged and segregated from outside ambient atmosphere with relatively longer lifetime.
An end face of a transparent electrode or a backside electrode of an EL element is not bared at an end surface of an outer periphery of an EL insert molding or an end surface of an inner periphery of a through hole portion. A decorative film covers a front side of an EL element and molding resin is injected onto a backside surface of the EL element to form a molding resin portion. An end potion of the decorative film is bent to cover the end portion of the EL element and extends beyond the end portion of the EL element a distance larger than at least a thickness of the EL element.