A light is disclosed which may be an aircraft light, comprising a base 2 for mounting the light, a chassis 8 upstanding from the base, a circuit board 10 mounted upon an outer face of the chassis and at least one solid state emitter--and more preferably an aray of LEDs 24, 26--mounted upon the circuit board. The invention provides a light which is constructionally convenient but can provide a clean beam pattern.
This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.
This invention relates to a light emitting diode (LED) and a LED lamp consisted of LEDs. The LED comprises at least one LED chip. The LED is mounted on a high heat conductivity base and is connected to an applied power supply through a circuit board. The LED chip also has a transparent medium layer on it. The base top surface acts as a light reflective surface, or a light reflective surface is provided around the base, the LED comprises a screw extended downwards from the base bottom or a screw hole in the base bottom to connect the LED to a heat sink mechanically. The LED is electrically connected to a driving circuit through its outgoing wires. The driving circuit is in turn electrically connected to an electrical connector through its housing. A LED lamp can be fabricated after the LED is enclosed in a transparent bulb housing. The LED has high efficiency, high power and long lifetime and can be used to fabricate LED traffic lamps, LED plane light sources, etc.
An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipation surface. The diverter disrupts vertical airflow over the heat dissipation surface.
An aircraft rear position light device (1) has a modular configuration. The device utilizes solid-state light sources. In an exemplary embodiment, the light sources are side-emitting light-emitting diodes (LEDs) (40), which are attached to a heat sink (30). A reflector (200) is positioned next to each of the LEDs. The device further includes an outer lens (10) with an integrated cut-off shield (110) and optical treatments (120). The configuration of LEDs and reflectors, in conjunction with the cut-off shield and optical treatments, allows the emitted light to satisfy predetermined minimum and maximum angular intensity requirements. An electronics module (50) is also attached to the heat sink to connect the LEDs to a power source in the aircraft. Electronic updates may be made by replacing the electronics module.
An LED light module assembly for use with high power, high light output LED's includes a thin flexible circuit board with surface mounted LED's and other electronic components which is attached to a metal heat sink using a layer of a thermally conductive adhesive, such as a thermally conductive epoxy adhesive. A conduction path is provided from the LED carrier through the flexible circuit board by the incorporation of one or more thermally conductive vias in the region of the attachment pad used to bond the LED to the flexible circuit board. These vias provide a conduction path from the back side of the LED carrier through the circuit board to the thermally conductive adhesive and heat sink. The LED light module assembly has the capacity to dissipate between about 10-14 W of power without exceeding a maximum LED junction temperature of about 125.degree. C.