A method for detecting an anomaly on a first surface of a transparent substrate starts with providing a transparent substrate that has a reflective second surface. The method then comprises directing a radiation beam at the first surface of the substrate so that at least a portion of the radiation penetrates the substrate and strikes the reflective second surface. This radiation is reflected back as a reflected radiation beam through the first surface of the substrate. The method then comprises detecting radiation from the reflected radiation beam. This method can further comprise causing relative motion between the radiation beam and the first surface of the substrate. This method can also further comprise documenting the presence of an anomaly if the detected radiation shows that the reflected radiation beam was scattered upon traversing the first surface.
An apparatus and method for at-wavelength EUV mask-blank characterization for inspection of moderate and low spatial frequency coating uniformity using a synchrotron or other source of EUV light. The apparatus provides for rapid, non-destruction, non-contact, at-wavelength qualification of large mask areas, and can be self-calibrating or be calibrated to well-characterized reference samples. It can further check for spatial variation of mask reflectivity or for global differences among masks. The apparatus and method is particularly suited for inspection of coating uniformity and quality and can detect defects in the order of 50 .mu.m and above.
