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Method for controlling flatness of wafer and manufacturing method of thin-film magnetic head
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Document Number
US Patent 6599435
Issued Date
July 29, 2003
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Inventors
Kubota; Toshio
(Tokyo,JP)
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Kimura; Fujimi
(Tokyo,JP)
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Abstract
A gas at an extremely low temperature is jet-sprayed onto a warped concave surface of a wafer to correct this warped concave surface flat.
Patent Report
Tags:
method
controlling
flatness
wafer
manufacturing
thinfilm
magnetic
head
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Description:
Amusing 0%
Clever 0%
Complex 0%
Efficient 0%
Historic 0%
Important 0%
Innovative 0%
Interesting 0%
Practical 0%
Simple 0%
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Number of Claims:
10
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Owner
TDK Corporation
(Tokyo,JP)
Published
July 29, 2003
Application Number
09/867,425
Filed
May 31, 2001
US Classification
216/22
216/38 216/52 216/57
Int'l Classification
G11B 5/31 (20060101)
Examiner
Powell; William A.
Attorney/Law Firm
Burns, Doane, Swecker & Mathis, LLP
Priority Data
Jun 05, 2000 [JP] 2000-167411
USPTO Field of Search
216/22 216/38 216/52 216/57 216/89 134/31 134/37 438/691 438/692 438/693 438/706 438/748
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