A thin plate-shaped substrate 21 comprised of a monocrystal is provided with a piezoelectric element 24, and both ends of a movable piece 20 whose one surface is provided with a movable contact 25 are fixed and supported to a base 11. Then, by curving the movable piece 20 via the piezoelectric element 24, the movable contact 25 is brought in and out of contact with a pair of fixed contacts 38 and 39 that face the movable contact. With this arrangement, a subminiature micro-relay having a mechanical contact mechanism that has a small resistance in turning on the contact and the desired vibration resistance, frequency characteristic and insulating property can be obtained.
This is a divisional application of U.S. Ser. No. 09/254,030 filed Feb. 26, 1999 now U.S. Pat. No. 6,407,482, which is hereby incorporated by reference in its entirety.
Priority Data
Aug 27, 1996 [JP] 8-224845 Aug 27, 1996 [JP] 8-225286 Aug 27, 1996 [JP] 8-225288
Three chips, i.e., an LED, photovoltaic IC, and MOS-FET, are mounted on a silicon substrate having two projections arranged substantially parallel to each other. Each projection has a side surface formed by an inclined surface including a curve having an inflection point. The LED is mounted on an LED mounting electrode formed between the two projections, and connected, by a gold wire, to an LED connecting electrode formed between the projections. The photovoltaic IC is placed on the front-side surfaces of the projections so as to oppose the LED, and connected via gold bumps.
