A thin-film heat sink comprises a heat sink film functioning as a heat sink and a bonding film for bonding the heat sink film to a base. The bonding film is an aluminum oxide (Al.sub.2 O.sub.3) film formed using the CVD method and the heat sink film is an aluminum nitride (AlN) film. For the AlN film as the heat sink film, internal stress is compressive stress, whereas for the Al.sub.2 O.sub.3 film as the bonding film, internal stress is tensile stress.
The magnetic head is formed with a narrow pole tip, and a pole tip heating element is fabricated to reduce the pole tip stress and increase its permeability, such that the magnetization switching speed of the pole tip is increased. The heating element is preferably electrically interconnected within the induction coil circuit of the magnetic head, such that the electrical current flowing through the induction coil also flows through the heating element. In a preferred embodiment, the heating element is fabricated above the second magnetic pole. The heating element is preferably formed with a resistance of approximately 0.2 to 1.0 ohms, such that the approximately 40 mA current that flows through the induction coil and the heating element creates a heating energy of the heating element of approximately 0.3 to 1.6 mW. The heating element can be comprised of a variety of materials such as Cu, W, NiFe, NiCr and IrRh.
A magnetic head system, and method for manufacturing a magnetic head are provided. Included is at least one layer and a heating element positioned adjacent the at least one layer. The at least one layer includes a plurality of sub-layers for providing an optimal thermal barrier.
