A passive thermal spreader and method of fabrication are disclosed. The passive thermal spreader includes a heat transfer plate formed from laminated plates including an internal sealed thermosyphon defined within the interface of the plates. The preferred embodiment of the passive thermal spreader selected to illustrate the invention includes a pair of distinct thermosyphons defined within the interface of three laminated, stacked plates. Each thermosyphon includes a plurality of channels arranged boustrophedonically. Each of the channels includes an elongate straight portion and an end turn portion for connection to the adjacent channel elongate straight portion. Each elongate straight portion includes a channel divider. The channel divider directly contributes to the high performance of the thermal spreader of the present invention by assisting the transport of the working fluid.
A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.
A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. In the caps interconnect the ends of the micro tubes in fluid communications and to inlet and outlet tubes. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid is circulated through the micro tubes of the low profile extrusion, and a heat exchanger removes the heat from the heat transfer fluid.
A stackable heat transfer system incorporating a plurality of flow controlled endcaps facilitating select flow of heat transfer fluid through low profile extrusions. The low profile extrusions are mounted in a sandwiched configuration with thermal electric cooling arrays for providing heat dissipation from the cooler arrays and the heat transfer from a low profile extrusion sandwiched the cooler arrays.
A cooling apparatus has a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
A method for removing heat from a heat generating component using a low profile extrusion with a plurality of micro tubes extended there through. The low profile extrusion is placed into thermal connection with heat producing components. A heat transfer fluid removes heat via an adiabatic process.
