An image display apparatus has a hermetic container having therein first and second substrates arranged opposite each other. An image display unit is disposed within the hermetic container and a conductive bonding member that seals the first substrate and the second substrate is disposed between the first and second substrates. The electric potential of the conductive bonding member is specified.

A liquid-crystal display device has a pair of substrates (1, 2) which are opposite to each other and a semiconductor element which is directly joined to the substrate (2). A portion other than an active surface (12a) of the surfaces of the semiconductor element (12) is covered with a light-shielding member portion (16). Since the light-shielding member (16) completely shields light irradiated from the upper and side surfaces of the semiconductor element (12) and a joint surface between the semiconductor element (12) and the substrate (1), the semiconductor element (12) can be prevented from being erroneously operated.

A method of forming a via hole through a glass wafer includes depositing a material layer on an outer surface of the glass wafer, the material layer having a selection ratio higher than that of the glass wafer, forming a via-patterned portion on one side of the material layer, performing a first etching in which the via-patterned portion is etched to form a preliminary via hole, eliminating any remaining patterning material used in the formation of the via-patterned portion, performing a second etching in which the preliminary via hole is etched to form a via hole having a smooth surface and extending through the glass wafer, and eliminating the material layer. The method according to the present invention is able to form a via hole through a glass wafer without allowing formation of an undercut or minute cracks, thereby increasing the yield and reliability of MEMS elements.