A method of fabricating an interconnect line comprises forming a wall, depositing an etch mask having a thickness that decreases towards a bottom of the wall, and isotropically etching the wall at the bottom to form the interconnect line having a pre-determined gap between the substrate and a bottom of the line.
The centrifuge has truncated-cone-like separating screen arranged in support basket and held in the bottom thereof by lower flange. Lower flange has notched surface which penetrates into screen. The screen and the basket both have an annular upper edge and an upper flange which is attached to the upper edge of the basket and covers the upper edge of the screen. Finally, the screen is formed by a number of segments attached in pairs by a joint with a T-shaped section.
