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Solder work material for forming solder-coated circuit board and circuit board
   
Document Number
US Patent 6790293
Issued Date
September 14, 2004
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Abstract
There is provided a solder work material for forming solder-coated circuit boards, which is capable of preventing the malfunction of circuit that may be caused to generate by voltage noises that tend to be generated by the volumetrical expansion of the flux residue in a soldered laminated ceramic capacitor, etc. even under the environments where temperatures fluctuate widely (for example, -40.degree. C. to +85.degree. C.), or that may be caused to generate by voltage noises to be generated by the fluctuation of parasitic capacity between circuits which may be caused to generate due to a flux residue. There is also provided a circuit board having a residual film of flux left thereon after the deposition of the solder work material. This solder work material is formed of a solder paste composition or a resin flux-cored solder, both comprising a flux containing, as a resin component, acrylic resin for preventing the generation of voltage noises in electronic devices. The circuit board is accompanied with a residual film of such a flux.
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Number of Claims:
20
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Owner
NEC Corporation (Tokyo,JP)
Published
September 14, 2004
Application Number
10/147,171
Filed
May 13, 2002
US Classification
148/24  
Int'l Classification
B23K   35/36   (20060101)   B23K   35/02   (20060101)   H05K   3/34   (20060101)  
Examiner
Attorney/Law Firm
Priority Data
May 14, 2001 [JP] 2001-142830
USPTO Field of Search
148/24   148/23  
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