A method for marking a semiconductor wafer 302 includes the steps of: providing a reticle 300 including liquid crystal pixels; positioning the semiconductor wafer in proximity to the reticle; directing radiation through a first plurality of the pixels onto a first location on the wafer; changing the relative positions of the semiconductor wafer and the reticle; and directing radiation through a second plurality of the pixels onto a second location on the wafer. The first plurality of pixels can be used to form a first mark and the second plurality of pixels can be used to form a second mark, wherein the second mark is different from the first mark. The marks can be made of a pattern of dots in order to save space. The pixels can be selected to form certain marks by using a computer 304 to turn on or off a transistor that may be associated with each pixel. Also described is a system for marking a semiconductor wafer. The system includes a wafer mount 301; a radiation source 306 in proximity to the wafer mount; a reticle 300 which includes liquid crystal pixels and that is positionable between the radiation source and the wafer mount; and a mechanism 303 for changing the relative positions of the reticle and the wafer mount. The radiation source can be non-coherent far-ultraviolet, near-ultraviolet, or visible sources, or a laser.
A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.
An integrated circuit (IC) wafer includes a plurality of die and a first die indicator (FDI) formed on the wafer in a metal layer. The plurality of die include a first potentially good die and the FDI, which is detectable by a machine vision recognition system, provides a unique indication of the first potentially good die.
The invention involves a semi-conductor component testing system, a process for semi-conductor components, as well as an assembly, more particularly a wafer with several semi-conductor components to be tested, whereby each semi-conductor component is allocated an individual identifying label, more particularly an identification-number, in order to perform the test--done individually for each semi-conductor component--on the respective semi-conductor component.
A maskless pattern generating system for use in lithographic processing includes a liquid crystal pixel array. The system generates a light beam and applies a voltage level to each pixel of the pixel array to modulate a polarization state of the light beam so as to create a pattern image. The voltage levels correspond to greyscale levels assigned to the pixels. The system can receive a control signal input based on pattern information that defines the pattern image. The setting of the individual voltage levels can allow the liquid crystal pixel array to act as a phase shift mask, can allow the pattern image to be shifted, and can allow the manipulation of a pattern image edge. This maskless pattern writing system acts as a light valve to control pattern imagery, on a pixel by pixel basis, for the purposes of direct writing patterns.
