The resin composition of the present invention comprises (A) a resin composition comprising a polyphenylene ether resin or a polyphenylene ether resin and a polystyrene resin and (B) a phosphazene compound having an acid value of less than 0.5. This resin composition contains no halogen compounds and hence is environmentally preferred, and furthermore is excellent in electrical characteristics, heat resistance and mechanical properties, causes substantially no problems such as smoking during injection molding and desposition of flame-retardants on the mold, and has high flame retardancy.
This application is the national phase under 35 U.S.C. .sctn. 371 of PCT International Application No. PCT/JP01/07610 which has an International filing date of Sep. 3, 2001, which designated the United States of America.
