December 7, 2004

An apparatus for the treatment of semiconductor wafers, comprising a supportive frame and a process table arranged on the supportive frame. The process table comprises a stationary upper platen and a stationary lower plate. An intermediate indexing plate is rotatively arranged between the upper platen and the lower plate. At least one wafer support pin is attached to the indexing plate for the support of a wafer by the indexing plate. An upper housing is arranged on the upper platen and an outer lower housing is arranged on the lower plate. A displacable lower isolation chamber is disposed within the outer lower housing, being displacable against the indexing plate to define a treatment module between the upper housing and the lower isolation chamber in which the wafer is treated. A wafer supporting treatment plate is arranged within the lower isolation chamber, for controlled rapid treatment of a wafer within the treatment module.

18

December 7, 2004

10/186,823

July 1, 2002

118/719   118/729 118/730 156/345.31 204/298.25 204/298.27 204/298.28 204/298.35 414/935 414/939

C23F   1/00   (20060101)   C23C   16/00   (20060101)   H01L   21/66   (20060101)   H01L   21/02   (20060101)   B65G   49/07   (20060101)   H01L   21/306   (20060101)  

204/298.25   204/298.27   204/298.28   204/298.35   118/719   118/729   118/730   118/728   156/345.31   156/345.32   156/345.51   156/345.54   156/345.55   414/939  

7008879 - Isolation chamber arrangement for serial processing of semiconductor wafers for the electronic industry - Owned by Semigear, Inc. (Wakefield, MA) An apparatus for the treatment of semiconductor wafers, comprising a supportive frame and a process table arranged on the supportive frame. The process table comprises a stationary upper platen and a stationary lower plate. An intermediate indexing plate is rotatively arranged between the upper platen and the lower plate. At least one wafer support pin is attached to the indexing plate for the support of a wafer by the indexing plate. An upper housing is arranged on the upper platen and an outer lower housing is arranged on the lower plate. A displacable lower isolation chamber is disposed within the outer lower housing, being displacable against the indexing plate to define a treatment module between the upper housing and the lower isolation chamber in which the wafer is treated. A wafer supporting treatment plate is arranged within the lower isolation chamber, for controlled rapid treatment of a wafer within the treatment module.