February 22, 2005

The invention discloses a method for making two sided Multi-Chip Modules (MCMs) that will allow most commercially available integrated circuits to meet the thermal and radiation hazards of the spacecraft environment using integrated package shielding technology. The invention describes the technology and methodology to manufacture MCMs that are radiation-hardened, structurally and thermally stable using 3-dimensional techniques allowing for high density integrated circuit packaging in a radiation hardened package.

27

February 22, 2005

10/643,250

August 18, 2003

174/350   250/506.1 257/660 257/E23.114 257/E23.136 257/E23.189 257/E23.19 257/E25.012 257/E27.009 361/816

G21F   1/00   (20060101)   G21F   1/08   (20060101)   H01L   23/055   (20060101)   H01L   25/065   (20060101)   H01L   23/16   (20060101)   H01L   23/18   (20060101)   H01L   23/057   (20060101)   H01L   27/02   (20060101)   G21F   3/00   (20060101)   H01L   23/02   (20060101)   H01L   23/552   (20060101)  

This is a Continuation Patent Application of U.S. patent application Ser. No. 09/878,683, filed Jun. 9, 2003 for RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES, of Czjakowski, et al, now U.S. Pat. No. 6,613,978, which is a Continuation patent application of U.S. patent application Ser. No. 09/109,954, filed Jul. 2, 1998 for RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES, of Czajkowski, et al, now U.S. Pat. No. 6,262,362, which is a Divisional patent application of U.S. patent application Ser. No. 08/788,134, filed Jan. 24, 1997 for RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES, of Czajkowski, et al, now U.S. Pat. No. 5,880,403, which is a Continuation in Part of U.S. patent application Ser. No. 08/372,289, filed Jan. 13, 1995, for RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES, of Strobel, et al., now U.S. Pat. No. 5,635,754, which is a Continuation in Part of U.S. patent application Ser. No. 08/221,506, filed Apr. 1, 1994, for RADIATION SHIELDING OF PLASTIC INTEGRATED CIRCUITS, of Strobel, et al, now abandoned. U.S. patent application Ser. No. 08/788,134, filed Jan. 24, 1997 for RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES, of Czajkowski, et al, is a Continuation in Part of U.S. patent application Ser. No. 08/595,266, filed Feb. 1, 1996, now U.S. Pat. No. 5,889,316, which is a continuation of U.S. patent application Ser. No. 08/372,235, filed Jan. 13, 1995, now U.S. Pat. No. 5,825,042, which is a continuation of U.S. patent application Ser. No. 08/077,731, filed Jun. 18, 1993, now abandoned. All of the above patent applications are hereby incorporated herein by reference.

174/35R   174/35MS   361/816   361/818   361/800   257/659   257/660   250/506.1  

7145084 - Radiation shielded module and method of shielding microelectronic device - Owned by Freescale Semiconductor, Inc. (Austin, TX) A radiation shielded module (120, 500, 600, 700) and method of shielding microelectronic devices (126, 412, 618, and 718) including a single interconnect substrate (110, 400, 612, 712) having a first side (122, 410, 620, 720) and a second side (124, 416, 610, 710). At least one microelectronic device is coupled to the first side of the single interconnect substrate. A shielding structure (100, 200, 300, 614, 714) is coupled to the single interconnect substrate and configured to shield radio frequency interference (RFI) and electromagnetic interference (EMI) that propagate through at least a portion of the single interconnect substrate.