An electrical test probe tip, comprising a conductive flexible coil having a first end and a second end. The first end is for flexibly coupling with a device to be probed. The second end is attached to a connector. The connector may be an integral connection with a probing head or may be a connecting pin. Multiple test probe spring tips may be used to simultaneously probe signal and ground reference points. The present invention is also directed to a method for using the flexible spring tip.
The present application is a continuation of Patent Cooperation Treaty (PCT) application No. PCT/US01/24017, filed Jul. 30, 2001; PCT Application No. PCT/US01/24017 is a continuation of U.S. patent application Ser. No. 09/895,060, filed Jun. 29, 2001 (now abandoned); and U.S. patent application Ser. No. 09/895,060 is an application claiming the benefit under 35 USC Section 119 (e) of U.S. Provisional Patent Application No. 60/221,716, filed Jul. 31, 2000.
A puller/connector (9) for electrical raceways (1) having a spiral shape that is predeterminedly sized so as to lock onto the troughs (3) located on the external surface of an electrical raceway (24) or into the crests (2) located on the internal surface of an electrical raceway (25). Located on a first end of the puller/connector (28) is preferably a barb (10) that is utilized for locking the puller/connector (9) onto/into the electrical raceway (1). Additional embodiments of the puller/connector (9) include a knockout sizing converter (12) and a hooked end for grounding purposes, a puller/connector (9) having a threaded attachment (16) and a puller/connector (9) having a cover (18).
Electrical contact with elastic return and process for forming electrical contact with elastic return. Electrical contact includes a conductive part having a front surface structured and arranged to face an open end. The conductive part has a cut arranged to form at least one flexible blade from the front surface of a conductive part. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.
Apparatus and associated systems and methods may relate to a wide bandwidth cable assembly that may include an active amplification stage to receive high frequency signals (e.g., 1 GHz or above) through a transmission line extending distally to a passive, high density signal probe stage. In an illustrative example, the probe stage may receive multiple analog or digital signals from a device under test (DUT). In some embodiments, the probe stage may include probe pins with integrated series resistance to control signal loading, and an equalizer to shape the signal path's frequency response. The amplification stage may provide a virtual ground reference for a termination impedance that may match the transmission line's impedance and may connect in series with a feedback impedance. In one example, a minimally invasive probe head may facilitate measurement of multiple channels of a high speed data bus with minimal signal distortion and/or attenuation.
A plurality of conductive pads of an apparatus in one example are disposed on a circuit board in a predetermined arrangement compatible with an arrangement of probes on an external test connector. One or more of the plurality of conductive pads is disposed on an embedded layer of the circuit board.
