A multiprocessor integrated circuit is disclosed. A preferred embodiment of a multiprocessor chip has microprocessors formed on silicon-on-insulator regions and dynamic random access memory level-2cache memories or level-3 cache memories formed on bulk regions of the chip. A preferred embodiment includes a redundant architecture having a signal bus for coupling the microprocessors to the level-2 or level-3 cache memories in which the signal bus includes a programmable selector circuit for bypassing defective microprocessors or defective level-2 or level-3 cache memories.
RELATED APPLICATIONS
This application claims priority to and is a continuation of U.S. patent application Ser. No. 09/590,552, entitled "Hybrid Bulk/SOI Multiprocessors," filed on Jun. 9, 2000, now abandoned, by Robert P. Masleid, et al.
An electronic device is provided on which semiconductor packages can be mounted efficiently. The electronic device includes a board that can receive a plurality of first semiconductor packages each carrying a processor device and a plurality of second semiconductor packages each carrying a memory device. Mount regions where the packages are to be mounted and non-mount regions are alternately arranged in rows and columns on the board. This ensures approximately equal wiring distances between the packages, allowing processor devices to access associated memory devices at the same time.
Methods and apparatus provide for enabling a digital circuit by biasing at least one switch transistor ON such that a voltage potential of a virtual ground node is substantially equal to a voltage potential of a ground node for a power supply to the digital circuit, wherein the digital circuit is implemented using a plurality of transistors in a silicon-on-insulator (SOI) arrangement and at least some of the transistors are referenced to the virtual ground node; and disabling the digital circuit by biasing a gate terminal of the switch transistor below the voltage potential of the ground node.
