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Method of packaging semiconductor dice employing at least one redistribution layer    

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United States Patent6897096   
Link to this pagehttp://www.wikipatents.com/6897096.html
Inventor(s)Cobbley; Chad A. (Boise, ID); Brooks; Jerry M. (Caldwell, ID)
AbstractA method and apparatus for assembling and packaging semiconductor dice. The semiconductor dice or assemblies of stacked and electrically interconnected semiconductor dice are placed at mutually spaced locations with respect to a common plane and encapsulated in a dielectric material so that end portions of discrete conductive elements extending outwardly from each semiconductor die adjacent the common plane are exposed through an outer surface of the dielectric material. Redistribution lines are formed to extend from the exposed end portions of the discrete conductive elements to predetermined locations over the outer surface of the encapsulant which correspond with another interconnect outline and conductive bumps formed at the predetermined locations. Encapsulated semiconductor dice or die stacks may be severed from the encapsulant to form individual packages, or laterally spaced semiconductor dice electrically interconnected by redistribution lines may be maintained together as a group in a single package or module.
   














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Patent Text Patent PDF Print Page Summary File History
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Inventor     Cobbley; Chad A. (Boise, ID); Brooks; Jerry M. (Caldwell, ID)
Owner/Assignee     Micron Technology, Inc. (Boise, ID)
Patent assignment
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Publication Date     May 24, 2005
Application Number     10/417,056
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     April 16, 2003
US Classification    
Int'l Classification    
Examiner     Thompson; Craig A.
Assistant Examiner    
Attorney/Law Firm     TraskBritt
Address
Parent Case     CROSS-REFERENCE TO RELATED APPLICATION This application is a divisional of application Ser. No. 10/219,604, filed Aug. 15, 2002, pending.
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Patent Tags     packaging semiconductor dice employing least one redistribution layer
   
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