A method of forming a film of a coating solution on a substrate includes steps of moving a coating solution discharge member relative to a substrate while a coating solution is being discharged from the coating solution discharge member to the surface of the substrate, and changing a discharge direction of the coating solution to an outer peripheral portion of the substrate to make the amount of application to the outer peripheral portion smaller than that to other portions. This can reduce the amount of application to the outer peripheral portion of the substrate, thereby making it possible to restrain protuberance of the coating solution at the outer peripheral portion of the substrate caused by surface tension. Consequently, a coating film which is uniform also at the outer peripheral portion on the substrate is formed.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 11-328800, filed Nov. 18, 1999, and is a divisional application of U.S. patent application Ser. No. 09/712,179, filed Nov. 15, 2000, now U.S. Pat. No. 6,537,373 the entire contents of which are incorporated herein by reference.
