or
Bookmark and Share
Fixture used to prepare semiconductor specimens for film adhesion testing
   
Document Number
US Patent 6936843
Issued Date
August 30, 2005
Link
Inventors
Map
Abstract
The present disclosure pertains to a method of preparing a test specimen for testing of the bonding strength of a layer of additive material to a crystalline substrate, or testing of the bonding strength of one layer of additive material to a second layer of additive material, where both layers of additive material overlie a crystalline substrate. The method includes both test specimen "cutting" from a large sample of material and preparation of an individual test specimen for four-point adhesion testing. Also described is a fixture which is useful for cutting the individual test specimen from the large sample of material.
Tags:
Description:
Amusing 0%
Clever 0%
Complex 0%
Efficient 0%
Historic 0%
Important 0%
Innovative 0%
Interesting 0%
Practical 0%
Simple 0%
Number of Claims:
7
Comments:
no comments yet
Owner
Applied Materials, Inc. (Santa Clara, CA)
Published
August 30, 2005
Application Number
10/883,284
Filed
June 30, 2004
US Classification
257/48   257/350 438/48
Int'l Classification
H01L   23/544   (20060101)  
Assistant Examiner
Attorney/Law Firm
Parent Case
RELATED APPLICATIONS This application is a divisional of U.S. Application Ser. No. 10/629,071, filed Jul. 28, 2003 now U.S. Pat. No. 6,790,707, which is a continuation-in-part of U.S. application Ser. No. 10/435,306, filed May 9, 2003, which is abandoned.
USPTO Field of Search
257/48   257/350   438/455   438/48  
Related Patents
Claims
Description
About| FAQs| Terms & Disclaimer| Link to Us| Contact Us