A method of producing a multi-level electronic device that begins with machining into a sheet of dielectric material from a surface to create a set of first indentations at a first level. Conductive material is then deposited into the first indentations to create a set of first conductive features. The first indentations are then substantially filled with dielectric material. The process is continued by machining again into the sheet of dielectric material from a surface and thereby creating a set of second indentations at a second level. Further conductive material is deposited into the second indentations to create a set of second conductive features.
