An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional application of, and claims the priority benefit of, U.S. application Ser. No. 09/864,055 filed on May 23, 2001, now U.S. Pat. No. 6,794,752.
