A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
RELATED APPLICATIONS
This Patent Application is a continuation in part of U.S. patent application Ser. No. 10/439,635, filed May 16, 2003 and entitled, "METHOD AND APPARATUS FOR FLEXIBLE FLUID DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE", hereby incorporated by reference, which claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Serial No. 60/423,009, filed Nov. 1, 2002 and entitled, "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS", hereby incorporated by reference, as well as co-pending U.S. Provisional Patent Application Ser. No. 60/442,383, filed Jan. 24, 2003 and entitled, "OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING", which is also hereby incorporated by reference and co-pending U.S. Provisional Patent Application Ser. No. 60/455,729, filed Mar. 17, 2003 and entitled, "MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF", which is hereby incorporated by reference. This patent application also claims priority under 35 U.S.C. 119 (e) of the co-pending U.S. Provisional Patent Application Ser. No. 60/423,009, filed Nov. 1, 2002 and entitled, "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS", hereby incorporated by reference, as well as co-pending U.S. Provisional Patent Application Ser. No. 60/442,383, filed Jan. 24, 2003 and entitled, "OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING", hereby incorporated by reference, and co-pending U.S. Provisional Patent Application Ser. No. 60/455,729, filed Mar. 17, 2003 and entitled, "MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF", which is hereby incorporated by reference.
7290591 - Cooling mold with gas grooves - Owned by Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien,TW) Foxsemicon Integrated Technology, Inc. (Chu-Nan, Miao-Li Hsien,TW)
A cooling mold (262) includes a cooling portion (2632), and defines a channel. The cooling portion has a number of intersecting grooves (2636). The channel communicates with at least one of the grooves. The channel and the grooves are configured for gas to flow therethrough to a workpiece at least partly received in the cooling portion.
Methods and apparatus to provide an improved package on package (PoP) design are described. In one embodiment, a central processing unit (CPU) package substrate and an embedded package (which may include one or more heat removal channels) are molded. Other embodiments are also described.
A cold plate assembly, which in one embodiment includes a manifold layer comprising one or more input coolant sub-manifold channels and one or more output coolant sub-manifold channels. A metering plate having a plurality of orifices defined there through is disposed adjacent the manifold layer in spaced relation to a cover plate. A core layer is disposed between the metering plate and cover plate, the core layer comprising corrugated fin material. The input sub-manifold channels and output sub-manifold channels are in fluid communication through fluid paths passing through the orifices in the metering plate and the core layer.
A semiconductor device comprising a semiconductor component, particularly a power laser diode bar, disposed on a cooling element, wherein the cooling element contains in its interior a cooling channel for conducting a coolant. The coolant channel comprises in at least one region microstructures for effective heat transfer to the coolant. The semiconductor component substantially completely overlaps the region of the cooling channel comprising the microstructures. Disposed between the semiconductor component and the cooling element is an intermediate support so arranged and configured that it compensates for mechanical stresses between the semiconductor component and the cooling element occurring as a result of differing thermal expansions of the semiconductor component and the cooling element. The material of the cooling element particularly preferably has a high modulus of elasticity such that the compensation takes place substantially within the elastic strain regime.
Embodiments of the present invention include an apparatus, method, and system for providing a flow distributive interface for a thermal management arrangement.
