A packaged IC includes an IC die with signal and signal complement traces positioned relative to each other to maximize broadside coupling for a matching impedance. The signal and signal complement traces are electrically connected to transmission or receive channels of the IC die. Use of a broadside coupled trace configuration alleviates routing congestion in an IC package and permits an IC to accommodate a greater number of channels within a given surface area than is possible under the prior art.
This is a Divisional of application Ser. No. 10/114,625, filed on 04/02/2002 now abandoned, the entire disclosure of which is incorporated herein by reference.
