An insulated conducting wire (ICW) having an inorganic cladding and a microwire positioned within the cladding. The outer diameter of the microwire is less then the inner diameter of the cladding, and the insulated conducting wire is substantially free of bonding between the microwire and the cladding. A process of making a wire, having the steps of: drawing an inorganic tube through a heating zone such that the inner diameter of the tube is reduced; inserting a microwire into the tube whereby the tube becomes a cladding; and adjusting the draw process parameters such that the inner diameter of the cladding is larger than the outer diameter of the microwire, and the microwire and the cladding are not in contact with each other under thermal conditions that would cause bonding between the microwire and the cladding.
This application is a continuation-in-part application of U.S. patent application Ser. No. 10/326,962 to Tonucci et al., filed on Dec. 20, 2002, now abandoned, the entire file wrapper of which is incorporated herein by reference.
