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Integrated circuit including an inductive element having a large quality factor and being highly compact
   
Document Number
US Patent 7002233
Issued Date
February 21, 2006
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Inventors
Gamand; Patrice (Douvres la Delivrande,FR)
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Abstract
An integrated circuit including a substrate, a conductive layer, at least one inductive element superposed on the conductive layer and formed by a metallic turn having an outer contour and an inner contour, which bound between them a surface referred to as the radiation surface, and insulating material for insulating the conductive layer from the inductive element. The conductive layer has a surface substantially identical to the radiation surface.
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Number of Claims:
20
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Published
February 21, 2006
Application Number
09/883,438
Filed
June 18, 2001
US Classification
257/531   257/528 455/257 455/258
Int'l Classification
H01L   29/00   (20060101)  
Examiner
Assistant Examiner
Priority Data
Jun 20, 2000 [FR] 00 07864
USPTO Field of Search
327/280   327/290   257/531   257/508   257/E21.022   257/528  
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