Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in the imaging portion of the die, the die can be electrically connected to a substrate and then encapsulated. Since the imaging portion is sealed, the encapsulant cannot get underneath the glass. By ensuring the encapsulant is not filled beyond the glass, encapsulant cannot get over the glass either.
One embodiment of this invention pertains to multiple encapsulated thin-film electronic devices. These encapsulated devices include a substrate and multiple thin-film electronic devices are on this substrate. Each of the multiple thin-film electronic devices has an active area. The encapsulated devices also include an encapsulation layer that is on the substrate and this encapsulation layer has multiple holes and these multiple holes are over the active areas of the multiple thin-film electronic devices. The encapsulated devices also include multiple substantially flat encapsulation pieces that are on the encapsulation layer and these multiple substantially flat encapsulation pieces cover the multiple holes of the encapsulation layer. An absorbent material is not attached to any of the substantially flat encapsulation pieces.
