An electrical joint forming member is held between adjacent conductive members included in a semiconductor device fabricating apparatus to reduce electrical resistance between those conductive members. The electrical joint forming member includes an elastic member made of a titanium sheet (75 .mu.m thick, 2 mm wide) and having a surface covered with an aluminum layer (7 .mu.m thick), the aluminum layer being formed by joining an aluminum sheet to the surface of the titanium sheet by cold-roll bonding.
A wire (12) is bent into a row of contactors (14) that are each of miniature cloverleaf shape with each cloverleaf having a plurality of loops (21-24), the cloverleafs are then cut apart at cuts (40) to electrically isolate them from each other, and the middles of the cloverleafs are embedded into a block (43) of polymer. The combination of a row of cloverleafs and the block, are placed between upper and lower groups of terminals (30, 32) and compressed between them, to connect each upper terminal to a lower one.
