A system that provides packaging for a surface acoustic wave filter in such a way that the surface acoustic wave filter is capable of integration with a number of additional electronic devices on an integrated substrate. The surface acoustic wave filter is mounted in a "flip chip" configuration that enables the surface of the surface acoustic wave filter to be protected from a molding compound during and after the encapsulation of the surface acoustic wave filter and other circuitry contained on the integrated substrate. The manner in which the surface acoustic wave filter is packaged provides a great reduction in cost and occupied real estate on the integrated substrate, in that, the surface acoustic wave filter is mounted in such as way as not to require conventionally used ceramic packaging that encases the surface acoustic wave filter. An air gap is preserved between the surface acoustic wave filter side of the surface acoustic wave filter and the integrated substrate on which it is mounted. This air gap ensures proper operation of the surface acoustic wave filter. In addition, a passivation layer is deposited on the surface acoustic wave filter side of the surface acoustic wave filter before it is mounted in the "flip chip" configuration, thereby provided a degree of protection of the surface acoustic wave filter side of the surface acoustic wave filter.
RELATED APPLICATIONS
This application is a continuation application from U.S. patent application Ser. No. 09/455,108, filed Dec. 6, 1999, now U.S. Pat. No. 6,754,471 which is hereby incorporated by reference for all purposes.
A method and an apparatus for integrating a surface acoustic wave (SAW) filter and a transceiver are provided to solve the problem of having a large area of the prior-art integration of a SAW filter and a transceiver; wherein a device for integrating a SAW filter and a transceiver is provided and a component stack method is used to accomplish the integration of the SAW filter and the transceiver, and thus besides featuring a low cost and a small area as well as avoiding a signal loss, the invention can further include a design of encapsulating other components and chips, or even suitable to be used for various integrated circuit packaging technologies (such as QFP and BGA, etc.)
